WMSIC Electronic Components

FUXINSEMI SS510B

ModelSS510B
PackageSMB(DO-214AA)
BrandFUXINSEMI
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
FUXINSEMI SS510B
Type
FUXINSEMI
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
FUXINSEMI
Electronic Component
SS510B
Electronic Component
1
Package
SMB(DO-214AA)
Electronic Component
Schottky Diode
Electronic Component
0.188g
Electronic Component
1
Electronic Component
BM0230032088
Current
5A
Diode
1
(Vf)
850mV@5A
Electronic Component
55℃~+150℃
Electronic Component
Electronic Component
Electronic Component
3000
Voltage Rating(Vr)
100V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

SS510B 产品概述

一、产品简介

SS510B 是富芯森美(FUXINSEMI)推出的一款独立式肖特基(Schottky)整流二极管,封装为 SMB(DO-214AA)。该器件在大电流工况下具有较低的正向压降和优良的恢复特性,适合用于开关电源、降压转换器、整流及续流等功率应用场景。主要电气参数为:正向压降 Vf = 850 mV(在 5 A 条件下)、直流反向耐压 Vr = 100 V、整流电流 IF = 5 A,允许工作结温范围为 -55 ℃ 至 +150 ℃。

二、主要参数一览

  • 器件型号:SS510B
  • 品牌:FUXINSEMI(富芯森美)
  • 封装:SMB(DO-214AA),独立式(单颗封装)
  • 正向压降:Vf = 850 mV @ IF = 5 A
  • 直流反向耐压:Vr = 100 V
  • 整流电流(平均正向电流):IF = 5 A
  • 工作结温范围:-55 ℃ ~ +150 ℃
  • 典型用途:整流、续流、反向保护、开关电源输出整流等

三、性能特征与优势

  • 低正向压降:在大电流(5 A)等级下,Vf 约为 0.85 V,有助于降低导通损耗、提高转换效率,尤其适用于高频开关电源和点对点供电场合。
  • 快速恢复特性:肖特基结构使得反向恢复时间非常短,减小开关损耗和电磁干扰(EMI)问题,适合高开关频率应用。
  • 宽电压范围:100 V 的反向耐压满足多种中低压电源和汽车电子次级等应用需求。
  • 宽温度适应性:-55 ℃ 至 +150 ℃ 的结温范围使器件能在苛刻环境下长期可靠工作。
  • SMB 封装:封装体积适中,具备较好的散热能力与机械强度,易于自动贴装和回流焊接。

四、典型应用场景

  • 通用开关电源(SMPS)输出整流、续流二极管
  • 降压/升压/同步整流模块的保护与整流
  • 逆电保护、输入整流及电池充放电管理系统
  • 车载电子次级整流、工控电源及家电电源模块
  • 点对点电源、LED 驱动和高频整流场合

五、封装与热管理建议

  • 封装:SMB(DO-214AA),适合自动化装配;焊盘设计建议参考厂商推荐的 PCB 封装说明,以保证焊点可靠性与散热通道。
  • 散热:尽管 SMB 在体积上具有一定散热能力,但在高电流或连续功率消耗场合应通过扩大铜箔面积、在底层增加散热过孔或靠近散热铜板来降低结温。
  • 温度管理:设计时需确保实际工作结温远低于最大允许结温(150 ℃),并留出安全裕度以提高可靠性。建议在样机评估阶段测量器件结温并确认热设计。

六、电路设计与注意事项

  • 反向峰值电压:在选择二极管时应考虑电路中的瞬态尖峰和浪涌电压,必要时配合抑制器件(TVS、RC 抑制网络)以保护二极管不受过压影响。
  • 冷却与封装匹配:在高占空比或连续大电流工况下,推荐使用更大的铜面积或外部散热器以降低热阻。
  • 焊接与可靠性:遵循常规 SMT 回流焊工艺与 IPC/JEDEC 推荐规范进行焊接,避免超过器件允许的热应力。存储时防潮、防尘并在合理的管控下使用以保证焊接质量。
  • 测试与验证:在最终产品中,应对整流效率、结温、反向漏电和开关噪声进行验证,确保在典型与极端工况下均满足可靠性要求。

七、包装与订购信息

  • 单位包装:请参考厂商提供的卷带/散装包装规格。
  • 订购型号示例:SS510B(SMB,100 V,5 A)— 具体订货编码与数量请咨询富芯森美或其授权分销商。
  • 数据手册:在设计时应参考厂商完整版数据手册获取完整电气特性曲线、绝对最大额定值、热阻参数及焊接工艺建议等详细资料。

总结:SS510B 以其在 5 A 电流等级下较低的正向压降、快速恢复特性与 100 V 的耐压能力,成为开关电源及功率整流应用中的经济、可靠选择。合理的 PCB 散热设计和过压保护配合,可在多种工业与消费类电源方案中实现良好的效率与可靠性表现。若需更具体的电气特性曲线或热阻参数,建议索取厂商数据手册或样品进行实测验证。

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