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FUXINSEMI SS520B
Configuration
1 options
Configuration
Date code within 2 years
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- FUXINSEMI SS520B
- Type
- FUXINSEMI
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- FUXINSEMI
- Electronic Component
- SS520B
- Electronic Component
- 1
- Package
- SMB(DO-214AA)
- Electronic Component
- Schottky Diode
- Electronic Component
- 0.167g
- Electronic Component
- 1
- Electronic Component
- BM0230533278
- Current
- 5A
- Diode
- Electronic Component
- (Vf)
- 950mV@5A
- Electronic Component
- 55℃~+150℃
- Electronic Component
- Electronic Component
- Electronic Component
- 3000
- Voltage Rating(Vr)
- 200V
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
SS520B 产品概述
一、概述
SS520B 是 FUXINSEMI（富芯森美）推出的一款独立式肖特基整流二极管，封装为 SMB（DO-214AA）。器件在大电流环境下依然保持较低的正向压降，典型参数为 Vf = 950mV（在 IF = 5A 时），最大直流反向耐压 Vr = 200V，额定整流电流 5A，工作结温范围 -55℃ 至 +150℃，适用于要求高效率与高可靠性的电源应用场景。
二、关键电气与热参数
- 正向压降（Vf）：950mV @ IF = 5A（低压降有助于降低导通损耗）
- 逆向耐压（Vr）：200V（适合中高压整流和保护）
- 额定整流电流：5A（连续工作能力）
- 工作结温：-55℃ ~ +150℃（宽温度范围，适应恶劣环境）
- 封装：SMB (DO-214AA)，便于表面贴装或波峰焊工艺
三、主要特性与优势
- 低正向压降：在大电流通断时减少功耗与发热，提升系统效率。
- 肖特基特性：正向导通快速，无明显反向恢复，适合开关电源与高频整流场合。
- 宽温度范围与高可靠性：工业级温度性能使其可用于汽车电子、通信设备与工业电源。
- 标准化封装：SMB 封装便于在 PCB 上进行热管理与自动化贴装。
四、典型应用场景
- 开关电源（SMPS）输出整流与续流二极管
- DC-DC 转换器与电源模块中的高频整流
- 电池管理与充电电路的逆向保护与整流
- 太阳能逆变器、工业控制与电机驱动中的高压整流
- 通信设备与服务器电源的高效率路径
五、设计与应用建议
- 热管理：尽量在 PCB 上提供充足的铜箔散热区域，必要时并联散热器件或采用多层板提高散热能力。
- 退化与降额：在高温或长时工作条件下应按厂商推荐进行电流降额，以延长器件寿命。
- 封装注意：SMB 封装对焊接工艺敏感，遵循回流温度曲线与焊盘设计以保证焊接可靠性。
- 保护措施：在有较大反向电压尖峰的场合，应结合滤波与浪涌吸收元件以保护器件。
六、总结
SS520B 以其 950mV@5A 的低正向压降、200V 的耐压能力和宽工作温度范围，为需兼顾效率与可靠性的整流与保护应用提供了性价比较高的选择。选择时请参考厂商完整的技术规格书与应用指南，以获得最佳的性能与长期稳定性。
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