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FUXINSEMI SS26A
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- FUXINSEMI SS26A
- Type
- FUXINSEMI
- Minimum package
- 5000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- FUXINSEMI
- Electronic Component
- SS26A
- Electronic Component
- 1
- Package
- SMA(DO-214AC)
- Electronic Component
- Schottky Diode
- Electronic Component
- 0.097g
- Electronic Component
- 1
- Electronic Component
- BM0228045245
- Current
- 2A
- Diode
- Electronic Component
- Current(Ir)
- 100uA@60V
- (Vf)
- 700mV@2A
- Electronic Component
- 55℃~+150℃
- Electronic Component
- Electronic Component
- Electronic Component
- 5000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
SS26A 产品概述
一、产品简介
SS26A 是 FUXINSEMI（富芯森美）推出的独立式肖特基整流二极管，封装为 SMA (DO-214AC)。器件面向要求低正向压降和中等电流整流的开关电源、电源管理及保护电路，具有宽温区和良好可靠性，适合消费电子、工业电源及车载电子等场景。
二、主要参数
- 型号：SS26A（FUXINSEMI）
- 封装：SMA (DO-214AC)，独立式单管
- 反向耐压（Vr）：60 V
- 正向压降（Vf）：约 700 mV @ IF = 2 A
- 整流电流（平均）：2 A
- 反向漏电流（Ir）：最大 100 μA @ Vr = 60 V
- 结温范围：-55 ℃ ~ +150 ℃
三、产品特点
- 低正向压降：在较大整流电流下仍保持约0.7V的压降，有助于减小导通损耗和提升效率。
- 低反向漏流：在额定反向电压下漏电流控制良好，利于待机功耗优化。
- 宽温度范围：-55℃至+150℃的结温能力，适应恶劣环境。
- 标准表面贴装封装（SMA）：适合中功率密度的自动化贴装与回流焊工艺。
四、典型应用
- 开关电源（输出整流）
- DC-DC 转换器与降压模块
- 反向极性保护与肖特基门（OR-ing）电路
- 车载电源与工业控制电源
- UPS、充电器和适配器中的整流与续流保护
五、封装与热管理建议
SMA 封装散热受限，建议在 PCB 设计时为阳极/阴极焊盘配备较大铜箔面积并布置热过孔以利散热；在连续 2A 工作或高占空比条件下，应做热仿真或测量以确保结温低于安全范围。回流焊温度曲线按厂家焊接工艺规范执行，避免超过最大结温影响可靠性。
六、使用注意事项
- 在高 Vr 条件下应关注反向漏电流随温度上升而增加的特性，必要时选用更高规格器件或并联/并用其它保护措施。
- 推荐留有适当安全裕量（电压及电流）以提高使用寿命。
- 避免长期在极限结温下工作，必要时采用散热片或加强 PCB 散热。
七、订购与替代
品牌：FUXINSEMI（富芯森美），封装 SMA，型号 SS26A。若需替代，可考虑电气参数相近的 2A、60V 肖特基二极管，但应核对 Vf、Ir 与热阻等关键参数以保证兼容性。若需样片、规格书或封装图，请联系供应商获取详细资料与 PCB 尺寸图。
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