WMSIC Electronic Components

FUXINSEMI SMF3.3A

ModelSMF3.3A
PackageSOD-123FL
BrandFUXINSEMI
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
FUXINSEMI SMF3.3A
Type
FUXINSEMI
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
FUXINSEMI
Electronic Component
SMF3.3A
Electronic Component
1
Package
SOD-123FL
Electronic Component
Electronic Component
Type
TVS
Electronic Component
ESD and Surge Protection (TVS / ESD)
Electronic Component
0.042g
Electronic Component
1
Channel Count
Electronic Component
Electronic Component
BM0227636323
Operating Temperature
55℃~+150℃
Voltage
8.8V
Electronic Component
IEC 61000-4-2
Current(Ir)
500uA

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

SMF3.3A(FUXINSEMI)产品概述

一、产品简介

SMF3.3A 是富芯森美(FUXINSEMI)推出的一款单路、单向瞬态电压抑制二极管(TVS),专为3.3V工作电压系统提供瞬态过压和静电放电保护。器件采用SOD-123FL小封装,体积紧凑,适合表面贴装自动化生产,能够在恶劣温度环境下长期工作(-55℃ ~ +150℃)。

二、主要性能特点

  • 单向保护,适用于直流电源与信号线的正向瞬态钳位。
  • 钳位电压 Vc:8.8V(在规定脉冲条件下有效钳位)。
  • 击穿电压(VBR):6.58V(典型/测试条件)。
  • 反向工作电压(Vrwm):3.3V,适配3.3V电源轨。
  • 峰值脉冲功率:200W(10/1000μs 波形)。
  • 峰值脉冲电流 Ipp:22.7A(对应测试波形)。
  • 反向漏电流 Ir:500μA(在 Vrwm 下)。
  • 环境适应性强,工作温度范围宽:-55℃ ~ +150℃。
  • 满足 IEC 61000-4-2 静电放电防护等级要求,抗ESD能力优秀。

三、典型电气参数(概要)

  • 类型:TVS(瞬态抑制二极管)
  • 通道数:单路;极性:单向
  • 封装:SOD-123FL(SMD)
  • 峰值功率(10/1000μs):200W
  • 峰值脉冲电流:22.7A
  • 钳位电压:8.8V
  • 击穿电压:6.58V
  • 反向工作电压:3.3V
  • 反向漏电流:500μA
    (以上参数以制造商标准测试条件为准,具体数据请参照器件规格书)

四、典型应用场景

  • 3.3V 电源轨过压与浪涌保护(模块、电源板、单板系统)。
  • 数据/信号接口保护(UART、I2C、SPI 等低压数字接口)。
  • 通信设备、路由器、终端设备的端口防护。
  • 工业控制、仪表及楼宇设备中对抗静电与电磁脉冲场景。

五、封装与可靠性

SOD-123FL 封装提供良好的热散能力与自动贴装兼容性,适合批量SMT加工。器件能承受高能量短脉冲(200W, 10/1000μs),并在宽温度范围内保持稳定特性,适用于工业级应用。为确保长期可靠性,应参考制造商的热览图与脉冲能量循环寿命说明。

六、PCB 布局与选型建议

  • 将SMF3.3A尽量靠近受保护器件的输入端或外部连线/接口,缩短走线以降低寄生电感。
  • 接地端应有低阻抗、连续的接地平面,减小回流路径电感。
  • 对于高能量冲击场合,可考虑并联或与限流元件(熔丝、阻性元件)配合,以分散热量与限流。
  • 注意反向漏电随温度上升增加,若在高温环境长时间工作请评估静态耗电影响。
  • 选型时确认系统最大允许钳位电压对下游电路的耐受性。

七、注意事项与焊接说明

  • 识别极性并按标识方向贴装,单向器件不可反向用于双向保护场合。
  • 推荐使用符合无铅回流工艺的焊膏与工艺曲线,避免过冲温度超过封装热限。
  • 在应用设计中预留足够的安全裕量,避免频繁在峰值脉冲额定能量附近工作以延长寿命。
  • 采购与量产时,请以厂家规格书与认证文件为准,必要时进行样品测试验证系统兼容性。

如需获取完整规格书、封装尺寸图或样品测试数据,我可以帮您进一步查找或整理。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.