WMSIC Electronic Components

FUXINSEMI BZT52C5V6

ModelBZT52C5V6
PackageSOD-123
BrandFUXINSEMI
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
FUXINSEMI BZT52C5V6
Type
FUXINSEMI
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
FUXINSEMI
Electronic Component
BZT52C5V6
Electronic Component
1
Package
SOD-123
Electronic Component
Zener Diode
Electronic Component
0.033g
Electronic Component
1
(Zzk)
400Ω
(Zzt)
40Ω
Electronic Component
BM0264480211
Diode
1
Current(Ir)
1uA
Power Dissipation(Pd)
500mW
Electronic Component
5.2V~6V
Electronic Component
55℃~+150℃

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

BZT52C5V6 稳压二极管产品概述

一、产品简介

BZT52C5V6 是一款由 FUXINSEMI(富芯森美)提供的独立式稳压二极管,封装为 SOD-123,适用于小功率、低电流的参考和保护场合。标称稳压值围绕 5.6V(规格范围 5.2V~6.0V),拥有低反向泄漏和良好的温度适应性,便于在消费电子、通信和工业控制等系统中做简洁的电压钳位与基准应用。

二、主要电气参数

  • 稳压值(标称):5.6V(规格范围 5.2V~6.0V)
  • 反向电流 Ir:1μA(条件示例:2V 时为 1μA,实际随电压/温度变化)
  • 阻抗 Zzt:约 40Ω(在规定测试电流下的动态阻抗)
  • 阻抗 Zzk:约 400Ω(在击穿转折区或低电流区的阻抗特征)
  • 最大耗散功率 Pd:500mW(封装热限制,设计时应考虑降额)
  • 工作结温:-55℃ ~ +150℃

三、封装与热管理

SOD-123 小型封装利于表面贴装与紧凑设计,但热阻相对较大,因此 500mW 的耗散为器件在理想散热条件下的参考值。实际应用中建议给予适当散热路径或在高温/连续工作时进行功率降额,以保证结温不超过额定上限。

四、典型应用与特性注意点

  • 适合用作低功耗系统的电压基准、基线钳位或保护元件。
  • 由于 Zzt ≈ 40Ω,稳压精度/纹波抑制能力受限,不宜用于要求高精度的参考场合。
  • 反向泄漏低(μA 级),适合电池供电和待机电路。
  • 在脉冲或过压冲击场合,应注意能量吸收能力有限,必要时配合串联电阻或其它保护器件使用。

五、选型与可靠性建议

选择时以实际稳压点、最大工作电流和散热条件为准。长期可靠性考量应包括环境温度、最大结温控制和重复过压应力测试。若需更低阻抗或更高功耗,请考虑更高功率或不同封装的稳压器件。

型号:BZT52C5V6;品牌:FUXINSEMI(富芯森美);封装:SOD-123。该器件适合用于对成本、尺寸和功耗有严格限制,但对稳压精度要求适中的通用电子产品设计。

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