WMSIC Electronic Components

FUXINSEMI 2N7002KD

Model2N7002KD
PackageSOT-363
BrandFUXINSEMI
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
FUXINSEMI 2N7002KD
Type
FUXINSEMI
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
FUXINSEMI
Electronic Component
2N7002KD
Electronic Component
1
Package
SOT-363
Electronic Component
2 N
Electronic Component
MOSFET
Electronic Component
0.029g
Electronic Component
1
Electronic Component
BM0264480202
Power Dissipation(Pd)
150mW
Gate Voltage(Vgs)
±20V
Electronic Component
Electronic Component
Electronic Component
3000
Voltage(Vdss)
60V
Capacitor(Ciss)
40pF

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

2N7002KD 产品概述

一、产品简介

2N7002KD 是富芯森美(FUXINSEMI)推出的一款双通道 N 沟道小功耗场效应管,采用 SOT-363 封装,集成两只 N 沟道 MOSFET。器件额定漏源电压 60V,适合在空间受限的便携式和消费类电子中实现低速开关、电平移位与小电流驱动应用。

二、主要参数

  • 通道数量:2 × N 沟道
  • 漏源电压 Vdss:60V
  • 连续漏极电流 Id:340mA(单通道)
  • 导通电阻 RDS(on):5.3Ω @ Vgs=4.5V
  • 功耗 Pd:150mW(封装极限,注意散热)
  • 阈值电压 Vgs(th):2.5V(典型)
  • 栅极电压 Vgs(最大):±20V
  • 输入电容 Ciss:40pF;反向传输电容 Crss:10pF;输出电容 Coss:30pF
  • 封装:SOT-363(6引脚微型封装)

三、主要特性

  • 高耐压:60V 耐压适合中低功率开关场合。
  • 双通道集成:同封装内两路独立 MOSFET,节省 PCB 面积。
  • 低门容:Ciss 约 40pF,利于降低开关损耗与提高开关速度(适用于低频控制)。
  • 小封装低功耗:SOT-363 体积小,适合空间受限设计,但功耗 150mW 要求良好 PCB 散热设计。
  • 容易驱动:Vth≈2.5V,可被常见逻辑电平控制,但在 3.3V/5V 驱动下注意导通电阻特性。

四、典型应用

  • 低压侧开关与小电流负载驱动(继电器、指示灯、微型传感器等)。
  • 电平移位与开漏接口,用于将 MCU/逻辑信号转换到高电压域。
  • 便携设备的复位、断电与控制开关。
  • 保护电路中作为稳态电流限制或隔离元件。

五、使用建议与注意事项

  • 功率与散热:封装 Pd 仅 150mW,实际使用时需在 PCB 上增加铜箔散热并考虑热阻,避免在高电流和高占空比下长期工作。
  • 导通能力:RDS(on) 在 4.5V 门极电压下为 5.3Ω,若需更低压降或更大电流,应选择 RDS(on) 更低的器件或并联使用(并联需注意电流均分)。
  • 驱动电压:若以 3.3V 驱动,请验证在该电压下的导通情况与温升。
  • 开关特性:栅极电容较小,利于快速开关;驱动时仍需在栅极加上合适的限流电阻以抑制振铃并保护驱动端。
  • 引脚与封装:SOT-363 为微型封装,焊接时注意回流温度曲线与防静电保护(Vgs 最大 ±20V)。
  • 老化与可靠性:在高压或高温条件下应考虑失配与漂移,关键应用建议做寿命与温度应力测试。

六、封装与订购信息

  • 封装形式:SOT-363,小型 6 引脚载体,适合贴片自动化生产。
  • 品牌:FUXINSEMI(富芯森美)
  • 典型供货方式:卷盘(Tape & Reel)适配 SMT 装配线。
  • 选型提示:型号为 2N7002KD,购买时请与供应商确认出货规格书、器件批次及管脚定义,确保与 PCB 与原理图一致。

本器件适用于追求体积小、耐压高且仅需小电流开关控制的场景。选型与电路设计时请关注导通电阻、散热与驱动电压,必要时结合器件详细技术手册进行仿真与测试验证。若需替代方案或更高性能规格(更低 RDS(on) 或更大电流),可提供进一步对比与推荐。

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