Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
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Technical data
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
SS310A 是 FUXINSEMI(富芯森美)出品的一款功率肖特基整流二极管,适用于中功率整流与开关保护场合。器件额定直流正向电流为 3A,正向电压 Vf = 0.85V(在 3A 条件下),反向耐压 100V,非重复峰值浪涌电流 Ifsm 可达 80A。工作结温范围宽(-55℃ ~ +150℃),适合高温环境和车规类应用。封装采用 SMA(DO-214AC),便于自动贴装与散热设计。
以上参数表明 SS310A 在中等电流、高速开关场合具有良好性能,但其正向压降相对低压肖特基器件略高,需在系统热预算中考虑损耗。
SS310A 使用 SMA(DO-214AC)封装,体积紧凑、可靠性高,适合自动化生产。SMA 封装在 3A 级别应用中需要合理的 PCB 散热设计:增大焊盘铜箔面积、使用热过孔连接至内层或底层散热铜箔可显著降低结温。在高环境温度或持续大电流条件下建议进行热仿真与结温计算,确保结温不超过额定上限。
SS310A 的反向漏电在高温和高电压条件下会显著增加,系统设计时需要留有裕量;长期在高结温或频繁大幅浪涌下工作会影响器件寿命。选型时建议参考完整数据手册中的典型曲线(Vf‑I 曲线、Ir‑Vr 曲线、热阻参数等)并根据实际工作条件做热仿真与老化评估。
总结:SS310A 为一款结构紧凑、额定 3A 的肖特基整流二极管,凭借 100V 耐压与 80A 峰值浪涌能力,适合多种中功率整流与保护应用。合理的 PCB 散热与热管理是确保长期稳定运行的关键。若需更详细的电气特性或应用电路建议,请提供工作环境和峰值/平均电流等具体工作条件,以便给出更针对性的方案。
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Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
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