WMSIC Electronic Components

FUXINSEMI STPS5L60S

ModelSTPS5L60S
PackageSMC(DO-214AB)
BrandFUXINSEMI
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
FUXINSEMI STPS5L60S
Type
FUXINSEMI
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
FUXINSEMI
Electronic Component
STPS5L60S
Electronic Component
1
Package
SMC(DO-214AB)
Electronic Component
Schottky Diode
Electronic Component
0g
Electronic Component
1
Electronic Component
Schottky Diode
Electronic Component
BM0265133017
Current
5A
Diode
Electronic Component
Current(Ir)
200uA@60V
(Vf)
520mV@5A
Electronic Component
Electronic Component
Electronic Component
3000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

STPS5L60S肖特基二极管产品概述

STPS5L60S是富芯森美(FUXINSEMI)推出的一款独立式肖特基整流二极管,针对中低电压、大电流的整流及续流场景设计,凭借紧凑封装与高效性能,成为消费电子、工业控制及汽车电子等领域的常用功率器件。

一、产品核心身份与基本定位

STPS5L60S属于常规功率肖特基二极管系列,区别于集成式器件,采用独立式配置,可灵活适配不同电路布局;其设计核心围绕“低损耗、小体积、高可靠性”展开,满足5A连续电流下的稳定工作需求,是替代传统硅整流管的高效选择。

二、关键电气性能参数深度解析

STPS5L60S的电气参数精准匹配中低功率应用场景,核心参数及意义如下:

  1. 整流电流(IF):5A
    指25℃环境下可长期稳定通过的正向连续电流,覆盖多数中小功率电源的整流需求(如5V/3A、12V/5A电源的次级整流)。
  2. 直流反向耐压(VR):60V
    反向截止状态下可承受的最大电压,适用于12V、24V等低压电源系统,避免反向过压损坏。
  3. 正向压降(VF):520mV@5A
    肖特基二极管的核心优势——比普通硅整流管(通常1V以上)低30%以上的导通压降,直接降低导通损耗,减少电源发热,提升转换效率。
  4. 反向电流(IR):200μA@60V
    反向截止时的漏电流数值极小,说明反向截止性能优异,待机功耗低,长期工作稳定性高。

三、封装形式与物理特性说明

STPS5L60S采用SMC(DO-214AB)表面贴装封装,具备以下特性:

  • 尺寸紧凑:标准SMC封装尺寸约6.1mm×5.0mm×2.5mm,节省PCB空间,适配高密度电路设计;
  • 贴装兼容:引脚布局符合国际标准,可与同封装的其他肖特基二极管互换,支持自动化SMT生产;
  • 环境适应性:封装材料耐高温(工作温度范围通常为-55℃~150℃)、耐机械应力,可适应工业级与汽车级环境。

四、典型应用场景匹配

STPS5L60S的参数特性使其适配多种常见场景:

  1. 开关电源(SMPS):手机充电器、笔记本电源、LED驱动电源的次级整流,低VF提升电源效率(可达90%以上);
  2. 汽车电子辅助电路:车载充电器、车内LED照明的整流/续流,适应汽车-40℃~85℃的工作温度;
  3. 消费电子设备:机顶盒、路由器、智能家电的电源模块,紧凑封装适配小型化设计;
  4. 工业控制电路:小功率电机驱动的续流二极管,肖特基的快速开关特性(ns级)避免电机反电动势损坏器件。

五、品牌与可靠性支撑

富芯森美(FUXINSEMI)作为国内功率器件领域的成熟厂商,STPS5L60S经过多重可靠性测试:

  • 高低温循环测试(-55℃~150℃,1000次);
  • 湿度老化测试(85℃/85%RH,1000小时);
  • 反向耐压老化测试(60V,1000小时); 产品符合RoHS环保标准,无铅封装,批量一致性好,适合量产应用。

六、产品核心优势总结

STPS5L60S的核心竞争力体现在:

  1. 高效节能:低VF(520mV@5A)大幅降低导通损耗,减少散热需求;
  2. 空间节省:SMC表面贴装封装适配高密度电路;
  3. 稳定可靠:小反向漏电流+宽温范围,长期工作故障率低;
  4. 场景广泛:5A/60V参数覆盖整流、续流等多种中低功率需求;
  5. 成本可控:成熟工艺与批量供应,性价比优于进口同规格器件。

综上,STPS5L60S是一款高性价比的肖特基二极管,可满足多数中低功率电子设备的整流/续流需求,是工程设计中的实用选择。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.