WMSIC Electronic Components

FUXINSEMI UDD32C03L01

ModelUDD32C03L01
PackageSOD-323(SC-90)
BrandFUXINSEMI
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
FUXINSEMI UDD32C03L01
Type
FUXINSEMI
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
FUXINSEMI
Electronic Component
UDD32C03L01
Electronic Component
1
Package
SOD-323(SC-90)
Electronic Component
Electronic Component
Type
ESD
Electronic Component
ESD and Surge Protection (TVS / ESD)
Electronic Component
0.029g
Electronic Component
1
Channel Count
Electronic Component
Cj- Capacitor
0.7pF
Electronic Component
BM0225802173
Operating Temperature
55℃~+125℃
Voltage
17.5V
Electronic Component
IEC 61000-4-5;IEC 61000-4-2

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

UDD32C03L01 产品概述

一、产品简介

UDD32C03L01 是 FUXINSEMI(富芯森美)推出的一款双路双向 ESD 抑制二极管(TVS),以 SOD-323(SC-90)小型封装提供对高速信号线的浪涌和静电放电保护。器件针对 3.3V 工作电压系统优化,兼容工业温度范围,可在严苛电磁兼容(EMC)规范下为接口级电路提供可靠防护。

二、主要参数

  • 钳位电压(Vc):17.5V(在典型脉冲条件下测得)
  • 额定工作温度:-55℃ ~ +125℃
  • 击穿电压(Vbr):5.7V
  • 反向截止电压(Vrwm / 工作电压):3.3V
  • 峰值脉冲功率(Ppp):350W(单次脉冲规范)
  • 峰值脉冲电流(Ipp):20A
  • 反向漏电流(Ir):≤1 μA(在 Vrwm 下)
  • 结电容(Cj):约 0.7 pF(低电容,利于高速信号)
  • 通道数:双路;极性:双向
  • 标准符合性:IEC 61000-4-5(浪涌)、IEC 61000-4-2(静电放电)
  • 封装:SOD-323(SC-90)

三、性能特点

  • 3.3V 系统优化:Vrwm=3.3V 可直接用于各类 3.3V 数字接口,工作时不会影响正常信号传输。
  • 双向保护:对正负极性瞬态脉冲均可吸收,适用于无固定极性的差分或数据线。
  • 低电容:0.7 pF 的结电容对高速差分或单端信号(如 USB2.0、LVDS、SPI、I2C 等)影响极小,保证信号完整性。
  • 高脉冲吸收能力:350W 峰值功率与 20A 峰值脉冲电流,使器件可应对较强的浪涌和瞬态事件。
  • 宽工作温度范围:满足工业级应用的可靠性需求。

四、典型应用场景

  • 3.3V 接口保护:GPIO、UART、SPI、I2C 等单端接口的静电与浪涌防护。
  • 高速数据线:对延迟和信号完整性敏感的接口(USB2.0、差分信号的接地参考端保护)。
  • 通信设备与终端:路由器、交换机、网关、工业控制模块的前端端口保护。
  • 工业与消费电子:对抗静电冲击及配合浪涌防护要求的各种电子终端。

五、封装与 PCB 布局建议

  • 封装:SOD-323,适合 SMT 自动贴装与回流焊工艺。
  • 布局建议:将 UDD32C03L01 尽量靠近被保护的连接器或接口放置,走线最短、最宽、回流路径简单,降低寄生电感和阻抗。对于单端信号线,器件一端接信号线,另一端接地(或与参考地配置一致);对差分线,可根据电路拓扑选择跨线或单独并联保护。若系统对接地有严格要求,应配合地线回流设计与旁路电容优化。
  • 温度与焊接:遵循封装和制造商的回流曲线进行焊接,避免反复高温影响器件可靠性。

六、选型与可靠性建议

  • 若电路对泄漏电流敏感,可关注 Ir ≤1 μA 的典型表现,确认在 Vrwm 下满足系统静态功耗要求。
  • 对于超高速或极低容抗场景,0.7 pF 的电容性能良好;若更低电容为必需,可在选型时比较同类产品规格。
  • 在高能量浪涌环境(例如近雷区或电源端)使用时,建议配合适当的线路保护器件(如串联限流电阻、气体放电管或更高能量 TVS)构成多级保护方案。
  • 评估长期可靠性时,应在目标应用的脉冲、温度与机械应力条件下进行加速验证。

七、结论

UDD32C03L01 以其针对 3.3V 系统的工作电压、双向保护特性、低结电容及较高的脉冲吸收能力,适合用于需要兼顾信号完整性与可靠防护的接口电路。合理的 PCB 布局与多级保护策略可进一步提升整机抗扰度与长期可靠性,满足工业与民用产品的 EMC 要求。若需具体曲线、封装图及回流工艺参数,可参考厂商资料或咨询富芯森美技术支持。

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