WMSIC Electronic Components

FUXINSEMI SOD4007

ModelSOD4007
PackageSOD-123
BrandFUXINSEMI
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
FUXINSEMI SOD4007
Type
FUXINSEMI
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
FUXINSEMI
Electronic Component
SOD4007
Electronic Component
1
Package
SOD-123
Electronic Component
General Purpose Diode
Electronic Component
0.033g
Electronic Component
1
Electronic Component
BM0264480241
Current
1A
Diode
1
Current(Ir)
5uA@1kV
(Vf)
1.1V@1A
Electronic Component
55℃~+150℃
Electronic Component
Electronic Component
Electronic Component
3000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

SOD4007 产品概述

一、概述

SOD4007 是由 FUXINSEMI(富芯森美)提供的一款通用高压整流二极管,采用 SOD-123 小外形封装、单只独立器件设计。器件面向需要高反向耐压与中等整流电流的应用场景,兼顾体积小、安装便捷与可靠性要求,适用于开关电源、整流、浪涌保护与高压检测电路等。

二、主要参数

  • 二极管配置:1 个独立式
  • 正向压降 (Vf):1.1 V @ 1 A(典型值)
  • 直流反向耐压 (Vr):1000 V(1 kV)
  • 额定整流电流:1 A(直流)
  • 反向漏电流 (Ir):5 µA @ 1 kV
  • 非重复峰值浪涌电流 (Ifsm):25 A
  • 工作结温范围:-55 ℃ ~ +150 ℃
  • 封装:SOD-123
  • 品牌:FUXINSEMI(富芯森美)

三、性能特点

  • 高耐压:1000 V 反向耐压满足大多数高压整流与阻断需求,适合低频高压整流及开关电源输入侧保护。
  • 低反向漏流:在满电压 1 kV 条件下仅 5 µA 的漏电流,有利于高压浮空电路与测量电路的低泄漏要求。
  • 合理的正向压降:1.1 V @1 A 的正向压降在高压场合可以接受,同时兼顾了功率损耗与热量管理。
  • 抗浪涌能力:25 A 的峰值浪涌电流允许器件在短时冲击情况下生存,适用于开机冲击或浪涌抑制场合。
  • 宽温度区间:-55 ℃ 到 +150 ℃ 的工作结温范围适应工业级环境。

四、典型应用

  • 开关电源整流与续流二极管(低功率变换器、辅助电源)
  • 高压整流电路(小功率 HV 电源、CRT 取代类电路)
  • 浪涌保护与反向电压阻断(输入滤波与保护回路)
  • 高频测量与保护电路(示波器探头保护、传感器前端防护)

五、封装与热管理

SOD-123 为常见的小封装表贴形式,占用板面积小,适合自动贴装与回流焊工艺。尽管器件额定整流电流为 1 A,但受限于小封装的散热能力,实际长期载流时需考虑 PCB 的铜箔散热片与良好的热传导路径;在高温或连续大电流条件下,应对器件做适当降额处理以保证可靠性。

六、使用注意与可靠性

  • 极性识别:安装时注意阳极/阴极标识,避免倒装造成永久损坏。
  • 焊接工艺:建议遵循厂家或行业回流焊标准,控制预热与峰值温度并避免重复高温循环。
  • 降额设计:在长期稳定运行场景下,对比规格应留有安全裕度(电流与温度)。
  • 浪涌与温度:若应用存在频繁大浪涌或较高结温,应评估替代更高功率或更大封装的器件。

七、选型建议与替代

SOD4007 适用于对体积与高压要求同时存在、功率需求不大的设计。当需要更高持续电流或更低正向压降时,可考虑更大封装或肖特基类型器件;若对漏电流要求更严苛,则可选择低漏型高压二极管。选型时建议结合实际工作电流、占空比、散热条件与浪涌情形进行热仿真与应力验证。

本产品由 FUXINSEMI(富芯森美)供应,封装为 SOD-123,适合表贴自动化装配。如需具体封装图、典型电路图或可靠性测试报告,可向供应商索取完整数据手册以获得详细工艺与焊接建议。

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