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FUXINSEMI SS34B
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- FUXINSEMI SS34B
- Type
- FUXINSEMI
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- FUXINSEMI
- Electronic Component
- SS34B
- Electronic Component
- 1
- Package
- SMB(DO-214AA)
- Electronic Component
- Schottky Diode
- Electronic Component
- 0.18g
- Electronic Component
- 1
- Electronic Component
- BM0264480219
- Current
- 3A
- Diode
- 1
- Current(Ir)
- 500uA@40V
- (Vf)
- 550mV@3A
- Electronic Component
- 55℃~+150℃
- Electronic Component
- Electronic Component
- Electronic Component
- 3000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
SS34B 产品概述
一、概述
SS34B 是一款单体肖特基整流二极管，适用于中等功率整流与保护场景。该器件由 FUXINSEMI（富芯森美）提供，SMB（DO-214AA）封装，能在紧凑尺寸下提供稳定的3A整流能力和较低的正向压降，适配开关电源、DC-DC转换、汽车电子及工业电源等应用需求。
二、主要电气参数
- 二极管数量：1个独立式
- 最大整流电流（If）：3A（额定整流电流）
- 反向耐压（Vr）：40V
- 正向压降（Vf）：约0.55V @ 3A
- 反向漏电流（Ir）：约500µA @ 40V
- 工作结温范围：-55℃ ~ +150℃
这些参数表明 SS34B 在中低压功率链路中具有较好的效率与响应速度，肖特基结型使得正向压降低、开关恢复快，适合高频整流和低损耗保护场合。
三、热性能与环境适应性
SMB（DO-214AA）封装具有较好的散热能力，但在高电流长期工作时需配合良好 PCB 散热设计以降低结温。器件额定结温上限为150℃，在实际应用中建议保持结温尽量低于125℃以延长寿命。环境耐受性覆盖宽温区（-55℃到+150℃），可满足工业级与汽车电子的温度要求。
四、典型应用场景
- 开关电源次级整流与续流二极管
- DC-DC 升降压转换器的输出整流
- 逆极性与反向保护电路（电池保护）
- 太阳能微型逆变器与充电控制器
- 汽车电子低压电源管理（注意高温与浪涌场景的应力管理）
五、封装与焊接建议
- 建议在 PCB 上为 SMB 封装提供适当的散热铜箔面积，并在焊盘附近保留热过孔以增强热传导。
- 使用推荐的回流焊工艺参数，避免超出器件最高结温。若采用波峰或手工焊接，应控制焊接时间和温度以防损坏。
- 焊膏与助焊剂应符合无卤/无铅生产要求，若目标产品需环保合规，请确认器件的 RoHS/无铅版本。
六、设计注意事项与可靠性建议
- 反向漏电在高压下可增加器件功耗与自热，设计时需考虑在最大反向电压下的漏电及其对温度的影响。
- 若用于脉冲或浪涌条件下，应评估峰值电流与热冲击能力，必要时并联或选用更高额定电流的方案。
- 在汽车或工业级应用中，应做热循环与振动试验验证长期可靠性，并考虑外加抑制元件（TVS）以应对瞬态过压。
七、总结
SS34B（FUXINSEMI）是一款面向中等功率整流与保护的 SMB 封装肖特基二极管，低正向压降（≈0.55V@3A）和40V反向耐压使其在高效率开关电源与保护电路中具有竞争力。为获得最佳性能，应重视 PCB 散热、焊接工艺与高压/高温下的漏电管理。若需器件数据表（Datasheet）或封装尺寸图以便进行电路与版图设计，可进一步提供，我将协助核对与建议。
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