WMSIC Electronic Components

FUXINSEMI USBLC6-2SC6 USBLC6

ModelUSBLC6-2SC6
PackageSOT-23-6L
BrandFUXINSEMI
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
FUXINSEMI USBLC6-2SC6
Type
FUXINSEMI
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
FUXINSEMI
Electronic Component
USBLC6-2SC6
Electronic Component
1
Package
SOT-23-6L
Electronic Component
Electronic Component
Type
ESD
Electronic Component
ESD and Surge Protection (TVS / ESD)
Electronic Component
0g
Electronic Component
1
Channel Count
Electronic Component
Cj- Capacitor
0.35pF;6pF;0.7pF
Voltage
9V
Electronic Component
BM0230032097
Operating Temperature
55℃~+125℃
Voltage
10.4V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

USBLC6-2SC6 产品概述

一、概述与核心参数

USBLC6-2SC6 是一款面向 USB 及高速数据接口的三通道单向瞬态抑制器(ESD 保护器),由 FUXINSEMI(富芯森美)推出,采用小型 SOT-23-6L 封装,适用于便携设备和消费电子的接口防护。该器件在保证数据完整性的同时,能够在瞬态冲击时将有害能量钳制到安全电平,保护后端电路免受损坏。

主要参数一览:

  • 极性:单向(单极,正向钳位至地)
  • 反向截止电压 (Vrwm):5 V(适配常见 5V 系统)
  • 钳位电压 (Vc @ Ipp):10.4 V
  • 峰值脉冲电流 (Ipp):8 A
  • 峰值脉冲功率 (Ppp):120 W
  • 击穿电压:9 V
  • 反向漏电流 (Ir):10 nA
  • 通道数:三路
  • 工作温度范围:-55 ℃ ~ +125 ℃
  • 防护等级:符合 IEC 61000-4-2(静电放电)要求
  • 类型:ESD 抑制器
  • 结电容 (Cj):0.35 pF;6 pF;0.7 pF(三路各自不同)
  • 封装:SOT-23-6L
  • 品牌:FUXINSEMI(富芯森美)

二、性能特点与工作原理

  • 单向设计:在正向瞬态(正向电压冲击)时将过压引到接地,反向保持高阻抗,适合与具有确定极性的电源与信号线配合使用。
  • 低 Vrwm:5 V 的工作电压界定能直接兼容标准 USB 总线和常见 5V 系统,不会在正常工作条件下触发克服。
  • 有效钳位能力:在 8 A 峰值脉冲时钳位电压为 10.4 V,能够将瞬态电压迅速限制到安全水平,减少对后级保护器件或芯片的冲击。
  • 低漏电流:10 nA 的反向泄漏在多数高阻输入和低功耗应用中不会造成明显干扰。
  • 多通道差异化结电容:三路结电容分别为 0.35 pF、6 pF、0.7 pF,可在设计中用于区分高速差分数据线与电源或慢速信号线的保护需求,尽量降低对高速信号的串扰与信号完整性影响。
  • 高能量吸收能力:120 W 峰值脉冲功率和 8 A 峰值脉冲电流使其适合应对典型的 ESD 瞬态与浪涌事件。

三、应用场景

  • USB 接口保护(如 USB2.0/USB3.0 的上游/下游接口,兼顾高速数据线)
  • 手机、平板、笔记本等移动设备的外部 I/O 口
  • 摄像头、车载信息娱乐系统的外设接口
  • 工业或消费类电子的键盘、触摸、充电口等需要 ESD 防护的位置
  • 任何需要在 5 V 系统下实现多路小体积 ESD 防护的场合

四、设计与布局建议

  • 靠近接口放置:将器件尽量靠近外部连接器的信号入口处布局,缩短从接口到保护器的走线,降低感抗和耦合路径,提升保护效果。
  • 走线和接地:各受保护线的走线应尽量短且直接,保护器的地脚与系统地通过一条短且低阻抗的回流路径连接;若是多层板,建议在保护器下方或附近增加接地过孔以改善回流。
  • 匹配高速信号:对高速差分信号优先使用低结电容(如 0.35 pF、0.7 pF)的通道,以尽量减少对信号上升沿和眼图的影响;慢速或电源线可使用较高结电容通道(6 pF)。
  • 与其它器件配合:在需要更高能量吸收或更低钳位电压时,可与串联电阻、电感或 TVS 并联使用,但需评估对信号完整性的影响。
  • 热和浪涌考虑:SOT-23-6L 的小封装在长时间或高频率冲击下要注意热量累积,保证周围有足够的散热与布局空间。

五、可靠性与注意事项

  • 温度范围宽:-55 ℃ 到 +125 ℃,适用于大多工业级与消费级环境。
  • 标称性能基于特定测试条件(如 8/20 µs 波形或相应标准脉冲);实际系统中 ESD 能量、频率和路径不同,测试验证仍然必要。
  • 结电容差异在设计前应与系统信号速率匹配,避免对高速链路造成额外抖动或插损。

六、总结与选型参考

USBLC6-2SC6 提供了三路、单向、低漏电、高能量吸收的 ESD 保护方案,适合空间受限且对信号完整性有要求的 USB 与一般高速接口。选型时重点考虑系统工作电压(Vrwm 5 V 匹配)、钳位电压能否保护后端器件、结电容对信号影响以及封装和布局约束。实际应用推荐在样机上对关键性能(ESD 抗扰度、信号完整性、热行为)做验证测试,以确保满足最终产品需求。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.