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FUXINSEMI 1SMB5918BT3G
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- FUXINSEMI 1SMB5918BT3G
- Type
- FUXINSEMI
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- FUXINSEMI
- Electronic Component
- 1SMB5918BT3G
- Electronic Component
- 1
- Package
- SMB(DO-214AA)
- Electronic Component
- Zener Diode
- Electronic Component
- 0.186g
- Electronic Component
- 1
- (Zzk)
- 350Ω
- (Zzt)
- 4Ω
- Electronic Component
- BM0230032096
- Diode
- 1
- Current(Ir)
- 5uA@2V
- Power Dissipation(Pd)
- 3W
- Electronic Component
- 4.84V~5.36V
- Electronic Component
- 65℃~+150℃
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
1SMB5918BT3G 产品概述
一 概要
1SMB5918BT3G 是富芯森美（FUXINSEMI）推出的一款独立式稳压二极管（Zener），标称稳压值为 5.1V，实际稳压范围为 4.84V 至 5.36V。器件采用 SMB（DO-214AA）封装，适合需要中功率稳定基准或过压钳位的应用场合。
二 主要电气参数
- 稳压值（标称）：5.1V
- 稳压值范围：4.84V ~ 5.36V
- 反向电流 Ir：5 µA @ 2.0V（漏电流较小，有利于低功耗场合）
- 耗散功率 Pd：3W（在推荐散热条件下）
- 动态阻抗 Zzt：4 Ω（在规定测试电流下表现出较低的小信号阻抗）
- 膝部阻抗 Zzk：350 Ω（反映低电流区的稳压特性）
- 工作结温范围：-65 ℃ ~ +150 ℃
三 封装与机械特性
SMB（DO-214AA）封装兼顾散热与可焊接性，适用于波峰/回流焊和手工焊接。封装尺寸利于表面安装并在中等功耗下通过良好布局实现热量传导到铜箔。
四 典型应用
- 5.1V 参考电压源与基准稳压
- 电源旁路、局部稳压和基准电路
- 信号线或电源线的电压钳位与瞬态保护（非专用TVS时限度内）
- 工业设备、仪表、通信模块等对稳定电压或过压保护有要求的场合
五 设计与热管理建议
为保证额定 Pd，需在 PCB 设计中提供良好散热路径：增大焊盘面积、使用多层铜箔或热沉导出。在高结温下稳压精度和寿命会受影响，建议在预期环境温度和最大功耗条件下进行热仿真与降额设计。
六 选型与使用注意
选择时关注稳压范围与实际工作电流区域，避免长期在膝部区域（低电流）工作以免稳压不稳定。对于对瞬态吸收能力有严格要求的场合，应优先选用专用 TVS 器件。
七 可靠性与环境适应
器件工作结温范围宽（-65 ℃ 至 +150 ℃），适应工业级环境。焊接和存储应遵循厂商的湿敏与焊接工艺说明，以保证长期可靠性。
总结：1SMB5918BT3G 在中等功耗稳压和钳位场景表现稳健，适合需要 5.1V 参考且要求良好散热和工业级温度适应性的应用。
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