WMSIC Electronic Components

FUXINSEMI MBR130LSFT1G

ModelMBR130LSFT1G
PackageSOD-123
BrandFUXINSEMI
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
FUXINSEMI MBR130LSFT1G
Type
FUXINSEMI
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
FUXINSEMI
Electronic Component
MBR130LSFT1G
Electronic Component
1
Package
SOD-123
Electronic Component
Schottky Diode
Electronic Component
0g
Electronic Component
1
Electronic Component
BM0219860070
Current
1A
Diode
Electronic Component
Current(Ir)
200uA@30V
(Vf)
380mV@1A
Electronic Component
55℃~+125℃
Electronic Component
Electronic Component
Electronic Component
3000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

产品概述:MBR130LSFT1G 肖特基二极管

1. 概述

MBR130LSFT1G是一款高效能的肖特基二极管,广泛应用于各种电源转换、整流和保护电路中。该二极管具有低正向压降和快速开关特性,以支持高频应用和降低功耗。作为一款SOD-123封装的独立式元器件,MBR130LSFT1G在尺寸和性能上都表现出色,特别适合于空间受限的电路设计。

2. 主要特性

  • 正向压降:MBR130LSFT1G在1A的工作电流下,其正向压降仅为约0.38V,这使其在导通时保持较低的功耗,从而提高能源效率。

  • 最大反向电压:该二极管的最大反向工作电压为30V,可以广泛用于各类低至中等电压电源应用中,提供稳定可靠的性能。

  • 整流电流:MBR130LSFT1G的整流电流额定值为1A,能够满足大部分低功率电子设备的需求。

  • 封装尺寸:采用SOD-123封装,尺寸小巧,适合空间紧凑的电路设计,与其他元器件的集成度高。

  • 高切换速度:肖特基二极管具有极其快速的恢复时间,适合用在频繁切换的电源电路中,确保电路的高效运行。

3. 应用场景

MBR130LSFT1G广泛用于多种电子和电气应用,其主要应用场景包括:

  • 开关电源:由于其快速开关特性,MBR130LSFT1G被广泛应用于开关电源转换器中,确保高效的功率转换和减少能量损失。

  • 整流电路:在交流电整流中,MBR130LSFT1G可以用作整流二极管,提供稳定的直流输出,广泛应用于各种电源适配器及充电器。

  • 电池管理系统:在电池充电和放电管理中,MBR130LSFT1G能够有效降低压降和发热,提高系统的整体效率。

  • 电源保护:其低反向恢复电流特性使得MBR130LSFT1G适用于电源的瞬态电压抑制,保护敏感元器件免受反向电压的影响。

4. 性能优势

  • 低功耗:由于其较低的正向压降,MBR130LSFT1G的工作效率显著提高,适合应用在对能效有较高要求的设备中,如便携式电子产品和可再生能源设备。

  • 高可靠性:MBR130LSFT1G在多种工作条件下显示出超强的稳定性和可靠性,适合长期运行的固定应用。

  • 节省空间:SOD-123小型封装使得MBR130LSFT1G特别适合于更小型化的设备设计中,能够帮助设计师节省电路板空间,优化整体设计。

5. 结论

MBR130LSFT1G凭借其卓越的性能和多功能应用,成为现代电源设计中不可或缺的有效解决方案。其低压降、高吞吐量和快速开关特性,使得该元器件在信息技术、工业控制、消费电子等各个领域均有广泛的应用前景。无论是在新的设计开发还是在现有系统的升级改造中,MBR130LSFT1G都是实现高能效、多功能和稳定性的理想选择。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.