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FUXINSEMI SS54C
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- FUXINSEMI SS54C
- Type
- FUXINSEMI
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- FUXINSEMI
- Electronic Component
- SS54C
- Electronic Component
- 1
- Package
- SMC(DO-214AB)
- Electronic Component
- Schottky Diode
- Electronic Component
- 0.314g
- Electronic Component
- 1
- Electronic Component
- BM0226574550
- Current
- 5A
- Diode
- Electronic Component
- (Vf)
- 550mV@5A
- Electronic Component
- 55℃~+125℃
- Electronic Component
- Electronic Component
- Electronic Component
- 3000
- Voltage Rating(Vr)
- 40V
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
SS54C 产品概述
一、产品简介
SS54C 为富芯森美（FUXINSEMI）生产的独立式肖特基整流二极管，封装为 SMC (DO-214AB)。该器件在中低压、大电流整流与开关电源中广泛使用，兼具低正向压降与快速切换特性，适合对效率与热性能有要求的电源应用。
二、主要特性
- 肖特基结构，正向压降低，能有效降低整流损耗
- 额定整流电流 5A，适合中等电流输出段应用
- 直流反向耐压 40V，适用于 12V/24V 等常见电源轨
- 宽工作结温范围：-55℃ 至 +125℃
- 独立式封装便于散热处理与并联分流
三、电气参数（关键）
- 正向压降 Vf：典型 0.55V @ IF = 5A（标称值，设计请参照曲线）
- 反向耐压 Vr：40V（最大额定阻断电压）
- 整流电流 IF(AV)：5A（在规定散热条件下）
注：反向漏电流、浪涌电流（IFSM）及温度相关特性请以详细数据手册为准。
四、封装与热管理
SMC（DO-214AB）为较大体积表面贴装封装，有利于散热。建议：
- 在焊盘处采用大铜箔面积并配合过孔将热量引至背面或散热层；
- 保持最短的电流回路以减少寄生电感；
- 在高环境温或连续大电流工况下做电流/温度降额设计。
五、典型应用场景
- 开关电源（整流、续流、同步整流替代）
- 汽车电子次级整流（24V/12V 系统）
- 电池供电设备的整流与防逆流保护
- DC-DC 转换器、功率模块及逆变器辅助整流
六、设计注意事项
- 肖特基二极管反向漏电随温度上升显著增加，高温工况需校核漏电和热稳定性；
- 若出现大幅脉冲浪涌，需验证 IFSM 能力或使用外部限流/吸收元件；
- 并联使用时注意匹配正向压降与热分配，必要时采用小阻值均流元件。
七、可靠性与环境适应
器件工作结温范围覆盖工业级温度（-55℃~+125℃），适合大多数工业与车规附近环境。最终可靠性与加速老化参数请参考富芯森美正式数据表与认证报告。
八、订购与替代型号
型号：SS54C，品牌：FUXINSEMI（富芯森美），封装：SMC。选型时如需更高耐压、更低 Vf 或更大平均电流，可考虑其他封装或更高规格的肖特基器件。为获得完整机械尺寸、热阻、反向漏电及冲击浪涌参数，请获取并参照厂商最新数据手册与封装图。
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