WMSIC Electronic Components

FUXINSEMI MURS360T3G

ModelMURS360T3G
PackageSMC(DO-214AB)
BrandFUXINSEMI
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
FUXINSEMI MURS360T3G
Type
FUXINSEMI
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
FUXINSEMI
Electronic Component
MURS360T3G
Electronic Component
1
Package
SMC(DO-214AB)
Electronic Component
Fast Recovery / High-Efficiency Diode
Electronic Component
0g
Electronic Component
1
Electronic Component
BM0230032103
Current
4A
Diode
Electronic Component
Current(Ir)
5uA@600V
(Vf)
1.28V@4A
Electronic Component
55℃~+150℃
Electronic Component
Electronic Component
Electronic Component
3000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

MURS360T3G 产品概述

一、产品简介

MURS360T3G 是富芯森美(FUXINSEMI)推出的一款独立式快恢复/高效率整流二极管,封装为 SMC (DO-214AB),旨在满足中功率开关电源与工业电源中对高压、快速恢复与低损耗的需求。该器件在大电流工作点具有较低的正向压降,同时保持600V的高反向耐压与较小的反向漏电,适合替代传统快恢复二极管以提升系统效率与抗浪涌能力。

二、主要电气与热参数

  • 二极管配置:独立式
  • 正向压降 (Vf):1.28 V @ 4 A
  • 直流反向耐压 (Vr):600 V
  • 连续整流电流:4 A
  • 反向漏电流 (Ir):5 μA @ 600 V
  • 反向恢复时间 (Trr):50 ns
  • 非重复峰值浪涌电流 (Ifsm):100 A
  • 结温工作范围:-55 ℃ ~ +150 ℃
  • 封装:SMC (DO‑214AB)
  • 品牌:FUXINSEMI(富芯森美)

三、性能亮点

  • 低正向压降:在 4 A 工作点 Vf 仅 1.28 V,显著降低传导损耗,有助于提升电源整体效率并减小散热要求。
  • 快恢复特性:50 ns 的反向恢复时间在开关频率较高的电源中可降低开关损耗与二次峰值应力,减小电磁干扰(EMI)和振铃。
  • 高耐压与低漏电:600 V 的反向耐压配合 5 μA 的漏电,适用于高压整流、反向阻断要求高的场合,兼顾稳态损耗与可靠性。
  • 强浪涌能力:Ifsm 100 A 能承受瞬态浪涌电流,增强系统在启动或故障瞬间的抗冲击能力。
  • 宽温度范围:-55 ℃ 到 +150 ℃ 的结温范围保证了器件在苛刻环境与工业级应用中的可靠性。

四、典型应用场景

  • 开关电源(SMPS)次级整流或回授整流
  • 电机驱动/变频器的快速整流与吸收回路
  • LED 驱动电源与恒流源整流
  • 逆变器、太阳能逆变与储能系统高压整流部分
  • UPS、充电器和适配器中的高压整流与吸收器件
  • 需要兼顾开关速度与耐压的工业电源与功率模块

五、封装与散热建议

SMC (DO‑214AB) 封装在中等功率等级中提供较好的热阻和机械强度。为保证长期可靠运行,建议在 PCB 设计与安装时注意:

  • 使用宽焊盘、加厚铜箔以降低导热阻抗;在高功率应用中可在焊盘下使用多个过孔以导入内层散热铜或底层散热片。
  • 保持器件周围空气对流或在必要时配合散热片/风流,以降低结‑壳温差并控制结温在额定范围内。
  • 在并联使用多个器件时确保电流分配均匀,采用相同走线长度与对称布局,必要时选配电阻均流或采用热耦合设计。

六、使用注意事项与可靠性考量

  • 反向恢复特性:尽管 Trr 为 50 ns 属于快恢复类别,但在超高频切换或极端斜率下仍可能产生较大瞬态电压,应配合 RC 缓冲网络或吸收器降低振铃与电压过冲。
  • 热结与电流额定:整流电流 4 A 为连续额定值,实际应用中应依据 PCB 散热能力对电流进行降额处理,尤其在高环境温度或密集布板时。
  • 浪涌与短时过载:Ifsm 100 A 提供短时浪涌保护,但频繁的冲击应尽量避免,以延长器件寿命。
  • ESD 与焊接:遵循常规无损焊接与回流工艺,避免过温或长时间高温暴露;存储与装配过程遵守静电防护规范。

七、选型建议

  • 与普通快恢复二极管相比,MURS360T3G 在高压与高频开关场景下兼顾低正向压降与较短恢复时间,更适合要求效率及抗干扰并重的设计。
  • 如系统对正向压降极其敏感且工作电压较低,可考虑高压 Schottky(但 Schottky 在高压通常表现欠佳);在需要更低的恢复电荷以减小开关损耗时,应权衡 Trr、Qrr 与 Vf 的综合指标。
  • 在并联或模块化设计中,优先保证散热一致性与电流均衡,必要时选择同批次器件以降低参数漂移带来的不均匀性。

总结:MURS360T3G 提供了 600 V 耐压、4 A 连续整流能力与较低的正向压降和快速恢复特性,适合用于中高压开关电源、逆变与工业电源的整流与回收应用。在实际设计中应重视散热与瞬态管理,以发挥器件最佳性能与可靠性。

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