WMSIC Electronic Components

FUXINSEMI B360B

ModelB360B
PackageSMB(DO-214AA)
BrandFUXINSEMI
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
FUXINSEMI B360B
Type
FUXINSEMI
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
FUXINSEMI
Electronic Component
B360B
Electronic Component
1
Package
SMB(DO-214AA)
Electronic Component
Schottky Diode
Electronic Component
0.183g
Electronic Component
1
Electronic Component
BM0227791057
Current
3A
Diode
Electronic Component
Current(Ir)
500uA@60V
(Vf)
650mV@3A
Electronic Component
Electronic Component
Electronic Component
3000
Voltage Rating(Vr)
60V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

B360B — 富芯森美(FUXINSEMI)肖特基二极管产品概述

一、产品简介

B360B 是富芯森美(FUXINSEMI)推出的一款独立式肖特基整流二极管,采用SMB(DO-214AA)封装。该器件针对中小功率整流和保护场景优化,具有低正向压降与快速开关特性,适合开关电源、降压整流、续流保护等应用。

二、主要特性

  • 正向压降 Vf = 650 mV @ If = 3 A(低功耗、降低整流损耗)
  • 额定整流电流 Io = 3 A(连续)
  • 非重复峰值浪涌电流 Ifsm = 100 A(短时耐浪涌能力强)
  • 直流反向耐压 Vr = 60 V
  • 反向电流 Ir = 500 μA @ 60 V(反向漏流低)
  • 封装:SMB (DO-214AA),便于手工焊接与自动贴装

三、典型电气性能说明

B360B 在 3 A 工作点处的正向压降约为 0.65 V,可有效降低整流损耗和系统发热。100 A 的非重复峰值浪涌能力保证了对输入浪涌、电流冲击或容性负载的瞬态承受力。60 V 的反向耐压使其可用于多数24 V/48 V类直流系统的整流与保护。

四、封装与热管理

SMB(DO-214AA)封装在实现中等功率处理的同时,便于在 PCB 上进行散热设计。建议在器件引脚附近采用较大铜面积或热铜滩,并视系统功率密度使用过孔导通到背面铜层以降低结温,保证长期可靠性。

五、典型应用场景

  • 开关电源输出整流与二次侧整流
  • DC-DC 降压转换器续流二极管
  • 逆接/反向保护电路
  • 电池充放电线路、LED 驱动与电源适配器

六、使用建议与注意事项

  • 布局时将二极管尽量靠近负载或整流位置,缩短信号回路,减小寄生感抗。
  • 对于高频开关场合,搭配合适的续流与缓冲元件以抑制尖峰。
  • 在接近峰值电流或高环境温度下,注意评估结温并提供必要的散热保障。

七、订购信息

品牌:FUXINSEMI(富芯森美)
型号:B360B
封装:SMB(DO-214AA)
如需样品、数据手册或可靠性测试数据,请通过供应渠道或富芯森美官方渠道索取完整规格书以获取详细温度特性与极限参数。

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