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FUXINSEMI FSV20100V
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- FUXINSEMI FSV20100V
- Type
- FUXINSEMI
- Minimum package
- 5000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- FUXINSEMI
- Electronic Component
- FSV20100V
- Electronic Component
- 1
- Package
- TO-277B
- Electronic Component
- Schottky Diode
- Electronic Component
- 0.181g
- Electronic Component
- 1
- Electronic Component
- BM0227636317
- Current
- 20A
- Diode
- Electronic Component
- Current(Ir)
- 100uA@100V
- (Vf)
- 660mV@20A
- Electronic Component
- Electronic Component
- Electronic Component
- 5000
- Voltage Rating(Vr)
- 100V
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
FSV20100V 产品概述
一、产品简介
FSV20100V 是富芯森美（FUXINSEMI）推出的一款独立式肖特基整流二极管，封装为 TO-277B。其主要电气参数为：正向压降 Vf = 660 mV（@ 20 A）、直流反向耐压 Vr = 100 V、直流最大整流电流 20 A、反向电流 Ir = 100 μA（@ 100 V）。该器件以低正向压降和肖特基特有的快速恢复特性，适用于高效率电源与开关电路中的整流与续流保护。
二、主要性能特点
- 低正向压降：660 mV @ 20 A，可显著降低整流损耗，提高系统效率。
- 低反向恢复：肖特基结构使得开关损耗和反向恢复时间极短，利于高频开关应用。
- 中等耐压等级：100 V 的反向耐压满足多数 12 V/24 V 及中低压电源系统需求。
- 可靠的高电流能力：连续整流电流 20 A，适合中大功率整流场合。
- 独立式封装（TO-277B）：便于散热设计和机板安装，适合需要良好热管理的应用。
三、电气与热分析（应用参考）
在满载 20 A 条件下，前向功耗约为 P = Vf × I ≈ 0.66 V × 20 A = 13.2 W，需通过合理散热（散热片或金属基板）将结温控制在安全范围内。器件在高温下反向电流随温度上升会明显增加（100 μA @ 100 V 为典型室温值），因此在高温或高压侧必须考虑漏电增加对系统的影响。具体的热阻（RθJA/RθJC）、最大结温等参数请参阅厂家正式数据手册以作精确热设计与降额计算。
四、典型应用场景
- DC-DC 转换器输出整流与续流二极管
- 开关电源（SMPS）整流、同步替代器件
- 电机驱动、步进控制中的续流保护
- 汽车电子低压系统、充电器与逆变器（符合耐压范围）
- 太阳能逆变器和能量回收系统的整流环节
五、封装与安装注意
TO-277B 封装便于与散热体良好接触，推荐在设计时预留合适的导热垫或螺栓固定方式以保证热阻有效降低。焊接与安装应遵循热冲击与焊接温度规范，避免长时间在高结温下工作导致寿命下降。大电流引线布局应尽量缩短并使用粗铜箔以降低寄生阻抗。
六、选型与采购建议
在选型时，确认系统峰值电流、重复峰值电压和工作环境温度，计算实际损耗并据此选择合适的散热方案和必要的电流余量。若需更详尽的参数（如浪涌电流能力、热阻、机械尺寸与引脚排列等），请索取 FUXINSEMI 官方数据手册或联系供应商获取技术支持。产品型号：FSV20100V，品牌：FUXINSEMI（富芯森美）。
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