WMSIC Electronic Components

FUXINSEMI BSS138

ModelBSS138
PackageSOT-23
BrandFUXINSEMI
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
FUXINSEMI BSS138
Type
FUXINSEMI
Minimum package
3000 卷

Technical parameters

Electronic Component
FUXINSEMI
Electronic Component
BSS138
Electronic Component
1
Package
SOT-23
Electronic Component
1 N
Electronic Component
MOSFET
Electronic Component
0.03g
Electronic Component
1
Electronic Component
BM0230032093
Operating Temperature
55℃~+150℃
Power Dissipation(Pd)
350mW
Electronic Component
Electronic Component
Electronic Component
3000
Voltage(Vdss)
50V
Capacitor(Ciss)
27pF
Resistor(RDS(on))
6Ω@4.5V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

BSS138 产品概述

一、产品简介

BSS138 是一款面向小信号开关与电平转换的 N 沟增强型场效应管(MOSFET),由 FUXINSEMI(富芯森美)提供,采用 SOT-23 小封装。器件最大漏源耐压 50V,适合低功耗、低电流的开关和电平移位场合。典型封装尺寸和低引脚寄生参数使其在便携设备、接口逻辑和微功率电路中得到广泛应用。

二、主要电气参数(基于所给规格)

  • 漏源耐压(Vdss):50V
  • 连续漏极电流(Id):约 220mA(短时、良好散热下可接近 340mA)
  • 导通电阻(RDS(on)):6Ω @ Vgs = 4.5V
  • 功率耗散(Pd):350mW(SOT-23 封装,受 PCB 散热影响较大)
  • 阈值电压(Vgs(th)):1.5V @ Id = 1mA
  • 输入电容(Ciss):27pF,反向传输电容(Crss/Coss):6pF
  • 工作温度范围:-55℃ ~ +150℃
  • 封装:SOT-23
  • 品牌:FUXINSEMI(富芯森美)

三、电气参数意义与工程解读

  • Vgs(th)≈1.5V 表明在 1.5V 左右开始导通,适合 1.8V~5V 逻辑电平控制,但在较低驱动电压下导通阻抗会较高。
  • RDS(on)=6Ω(Vgs=4.5V)提示此器件更适合做信号级开关或小电流负载切换,不宜用于大电流功率路径。
  • Ciss 与 Crss 值较小(27pF / 6pF),切换速度快、米勒效应小,有利于高频开关或作为电平移位晶体管。
  • Pd=350mW 限制了在 SOT-23 封装下的连续功耗能力,实际允许电流依赖 PCB 铜箔面积与散热条件,须注意结壳温升。

四、典型应用场景

  • 逻辑电平转换(例如 1.8V ↔ 3.3V、3.3V ↔ 5V 的双向电平移位)
  • 微控制器 I/O 的小电流开关与驱动
  • 信号复位/复用开关、低频直流电源断路控制(小于数百 mA)
  • 便携设备、电池供电系统中作为低泄漏、低寄生电容的开关元件

五、选型与使用注意事项

  • 若负载电流接近或超过几十到一百毫安,建议评估 RDS(on) 带来的压降与功耗;对高电流场合选择 RDS(on) 更低的功率 MOSFET。
  • 在 SOT-23 封装上,Pd 与电流受 PCB 散热影响显著;通过增加铜箔面积或使用散热通孔可以提升持续电流能力。
  • 驱动电压越高导通阻抗越低,但应避免超出器件允许的门极电压(参考厂商完整资料)。
  • Crss 值影响开关时的米勒效应,如用于高速切换,注意门极驱动和阻尼设计,避免振铃或误触发。

六、总结建议

BSS138(FUXINSEMI,SOT-23)凭借 50V 耐压、小寄生电容与低门限特性,是构建小信号开关和电平移位电路的实用器件。在选用时需关注 RDS(on) 与功耗限制,合理布线与散热设计可保证稳定工作。对需更大电流或更低导通阻抗的场合,应考虑替代的大功率 MOSFET。

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