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FUXINSEMI SS14
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- FUXINSEMI SS14
- Type
- FUXINSEMI
- Minimum package
- 5000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- FUXINSEMI
- Electronic Component
- SS14
- Electronic Component
- 1
- Package
- SMA(DO-214AC)
- Electronic Component
- Schottky Diode
- Electronic Component
- 0.1g
- Electronic Component
- 1
- Electronic Component
- BM0230032087
- Current
- 1A
- Diode
- Electronic Component
- Current(Ir)
- 500uA@40V
- (Vf)
- 550mV@1A
- Electronic Component
- Electronic Component
- Electronic Component
- 5000
- Voltage Rating(Vr)
- 40V
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
SS14（FUXINSEMI）产品概述
一、产品简介
SS14 为富芯森美（FUXINSEMI）出品的独立式肖特基整流二极管，封装为 SMA (DO-214AC)。主要规格：正向压降 Vf ≈ 550mV @ 1A，直流反向耐压 Vr = 40V，反向电流 Ir = 500µA @ 40V，额定整流电流 1A。适用于对低压降、快切换有需求的常规功率整流场合。
二、主要特性
- 低正向压降：减小导通损耗，适合低压差整流与功率路径。
- 快速响应：肖特基结构没有显著的反向恢复，适用于高频开关电源。
- SMD 封装：SMA 封装兼顾机械强度与焊接可靠性，便于批量贴装。
- 商用温度范围内性能稳定，结构可靠，性价比高。
三、电气参数解析及设计影响
550mV@1A 表示在满载时导通损耗约为0.55W，布局与散热需考虑这一功耗；40V 的反向耐压适合 12V/24V 等低压系统；反向漏电随温度上升显著增加，设计时应留有余量，避免在高温环境中长期接近最大反向电压。
四、封装与热管理建议
SMA (DO-214AC) 为表面贴装封装，建议在 PCB 铜箔上增加散热面积或热沉区，使用合理过孔与大焊盘改善热阻。推荐遵循器件厂家的回流焊工艺规范，避免长时间高温应力。
五、典型应用
适用于开关电源输出整流、降压转换器自由轮回、二极管 OR-ing/逆向保护、LED 驱动、电池管理与通用整流场景。因额定电流 1A，适合中低功率应用。
六、使用注意事项
- 持续 1A 工作需做好热设计与散热；短时浪涌电流能力有限，应参照具体浪涌规范。
- 高温下反向漏电会增加，注意热失控风险。
- 焊接与储存按标准避免潮湿与静电损伤，必要时做 100% 电性抽检。
七、质保与选型建议
富芯森美产品通常提供一致性测试与可靠性验证，选型时请索取完整数据手册以确认温度系数、瞬态参数及封装尺寸。如需更低漏电或更高电压/电流等级，可考虑其他型号或系列替代。
八、结论
SS14（FUXINSEMI）为一款性价比较高的 1A/40V 肖特基整流二极管，适合中低功率、低压降与高频整流场合。推荐在常温下并做好 PCB 散热设计使用，如需在苛刻环境应用，请参照完整规格书并做实际验证。
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