WMSIC Electronic Components

FUXINSEMI MBRS360T3G

ModelMBRS360T3G
PackageSMC(DO-214AB)
BrandFUXINSEMI
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
FUXINSEMI MBRS360T3G
Type
FUXINSEMI
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
FUXINSEMI
Electronic Component
MBRS360T3G
Electronic Component
1
Package
SMC(DO-214AB)
Electronic Component
Schottky Diode
Electronic Component
0g
Electronic Component
1
Electronic Component
BM0230032095
Current
3A
Diode
Electronic Component
Current(Ir)
30uA@60V
(Vf)
630mV@3A
Electronic Component
65℃~+175℃
Electronic Component
Electronic Component
Electronic Component
3000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

MBRS360T3G 产品概述

一、产品简介

MBRS360T3G 是富芯森美(FUXINSEMI)推出的一款独立式肖特基屏蔽二极管,封装为 SMC(DO-214AB),专为中低电压、高效率整流和保护场合设计。该器件在 3A 工作电流条件下正向压降仅约 0.63V,反向耐压可达 60V,兼具低损耗与良好可靠性,适用于多种电源与功率管理应用。

二、主要参数

  • 正向压降 (Vf):0.63V @ If = 3A
  • 直流反向耐压 (Vr):60V
  • 直流整流电流 (If):3A(连续)
  • 反向漏电流 (Ir):30μA @ 60V
  • 非重复峰值浪涌电流 (Ifsm):125A(单次脉冲)
  • 工作结温范围:-65℃ ~ +175℃
  • 封装:SMC (DO-214AB);独立式器件,便于通孔或散热布局

三、关键特性与优势

  • 低正向压降:在中大电流工作点能显著降低导通损耗,提高转换效率,特别适合降压/升压电源、整流桥和输出整流。
  • 低反向漏电:60V 条件下仅 30μA 漏电,利于提高待机效率并减少热失控风险。
  • 强抗冲击能力:125A 的峰值浪涌能力可应对开机或故障瞬态电流,增强系统可靠性。
  • 宽温工作范围:-65℃ 至 +175℃ 的结温范畴满足严苛工业与汽车电子环境(需配合适当热管理)。
  • 肖特基特性:反向恢复电荷极小,适合高频整流与开关电源中的快速自由轮回与续流应用。

四、典型应用场景

  • 开关电源(SMPS)输出整流或副边整流
  • DC-DC 转换器(降压/升压)整流与续流二极管
  • 汽车电子和工业电源的反向保护、极性保护与浪涌抑制
  • 电池充放电管理、太阳能逆变器及冗余电源路径
  • 高频整流与低压大电流应用场合

五、封装与热管理建议

SMC(DO-214AB)封装具有良好的功率散热能力,但在连续 3A 级别工作时仍需注意 PCB 散热设计:增大焊盘铜箔面积、使用过孔导热至底层散热层,并靠近散热体或铝基板布置。对于频繁浪涌或高环境温度,应考虑额外的热沉或降低额定工作电流以保证长期可靠性。

六、选型与使用注意

  • 当系统工作电压接近 60V 或存在高温环境时,应留有足够的余量,必要时选择更高 Vr 规格产品。
  • 若需并联以增加电流能力,应做好电流均流设计,避免单只过流导致失效。
  • 对于敏感信号路径或极低漏电要求场合,需核对具体漏电随温度变化的曲线并进行系统级评估。
  • 注意符合焊接工艺温度曲线,避免过热损伤封装或焊接失效。

总体而言,MBRS360T3G 以其低 Vf、低 Ir、较高浪涌能力及宽温特性,是中低压高效率整流与保护电路的可靠选择。在实际设计中,配合合理的散热与电气裕度,可获得优异的功率密度与长期稳定性。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.