WMSIC Electronic Components

FUXINSEMI FR1MD3

ModelFR1MD3
PackageSOD-323
BrandFUXINSEMI
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
FUXINSEMI FR1MD3
Type
FUXINSEMI
Minimum package
3000 卷

Technical parameters

Electronic Component
FUXINSEMI
Electronic Component
FR1MD3
Electronic Component
1
Package
SOD-323
Electronic Component
Fast Recovery / High-Efficiency Diode
Electronic Component
0.026g
Electronic Component
1
Electronic Component
BM0230804557
Current
1A
Diode
1
Current(Ir)
5uA@1kV
(Vf)
1.3V@1A
Electronic Component
55℃~+150℃
Electronic Component
Electronic Component
Electronic Component
3000
Voltage Rating(Vr)
1kV

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

FR1MD3 产品概述

一、产品简介

FR1MD3 是富芯森美(FUXINSEMI)推出的一款独立式快恢复/高效率整流二极管,采用 SOD-323 小型表面贴装封装。该器件针对中等功率、高耐压场合优化,兼顾开关速度与低漏电特性,适用于各种高压整流与开关电源应用。

二、主要特点

  • 额定整流电流:1A(连续)
  • 反向耐压(Vr):1000V,适合高压整流与保护用途
  • 正向压降(Vf):1.3V @ 1A,导通损耗可控
  • 反向电流(Ir):5μA @ 1kV,低漏电利于高压下的能耗控制
  • 反向恢复时间(Trr):500ns,属于快恢复等级,适配开关频率适中的电路
  • 工作结温范围:-55℃ ~ +150℃,耐环境能力强
  • 封装:SOD-323,低高度、适合密集布局与自动贴装生产

三、主要电气参数(概要)

  • 最大重复反向电压:1000V
  • 连续正向整流电流:1A
  • 正向电压:典型 1.3V @ 1A
  • 反向泄漏电流:典型 5μA @ 1000V
  • 反向恢复时间:500ns(典型)

(详细极限值与温度依赖特性请参阅器件数据表)

四、典型应用场景

  • 开关电源(SMPS)次级整流与高压整流
  • 逆变器与电机驱动的高压回路保护
  • 高频开关器件的缓冲与续流二极管
  • 光伏、充电桩等需要高耐压、低漏电的电路
  • 高压测量、电源取样与整流模块

五、封装与热管理

SOD-323 为低成本、低剖面表贴封装,便于自动贴片与回流焊接。由于器件额定整流电流为1A,设计时应考虑PCB铜箔扩展和散热路径,以保证器件在1A工作下处于安全结温范围内。并避免长期在高结温附近工作以延长寿命。

六、可靠性与使用注意

  • 尽量在额定参数范围内使用,避免重复大电流浪涌或超额反向电压冲击。
  • 在高压侧使用时注意爬电与绝缘要求,保证足够的间距与防护。
  • 回流焊工艺应遵循封装规范,避免过高回流峰值温度或超时焊接。
  • 对ESD 敏感线路做好防护,实际应用中建议结合熔断与限流器件提高可靠性。

七、推荐电路与工程建议

  • 用作整流时,可搭配适当滤波电容与限流电阻以减少峰值应力。
  • 在开关电源的续流或二极管箝位位置,FR1MD3 可替代普通慢恢复二极管以降低开关损耗与振铃,但在高频(>200kHz)场合需验证Trr对效率与电磁兼容的影响。
  • 高压设计推荐进行温升测试,必要时采取散热铜箔或热 vias。

八、品牌与采购

品牌:FUXINSEMI(富芯森美)。器件型号 FR1MD3,封装 SOD-323。具体订购信息、包装形式(卷盘、带装)、以及完整电气/热特性曲线请联系供应商或参阅富芯森美官方数据手册。

如需我协助生成电路封装建议、热仿真要点或同类替代型号比较,可提供具体应用场景(开关频率、最大电压、工作环境温度等),我将给出更有针对性的建议。

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