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FUXINSEMI BAT54T1G
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- FUXINSEMI BAT54T1G
- Type
- FUXINSEMI
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- FUXINSEMI
- Electronic Component
- BAT54T1G
- Electronic Component
- 1
- Package
- SOD-123
- Electronic Component
- Schottky Diode
- Electronic Component
- 0.033g
- Electronic Component
- 1
- Electronic Component
- BM0264480244
- Current
- 200mA
- Diode
- Electronic Component
- Current(Ir)
- 2uA@25V
- (Vf)
- 800mV@100mA
- Electronic Component
- Electronic Component
- Electronic Component
- 3000
- Voltage Rating(Vr)
- 30V
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
BAT54T1G 产品概述
一、概述与主要参数
BAT54T1G 为富芯森美（FUXINSEMI）推出的一款独立式肖特基整流二极管，采用 SOD-123 表面贴装封装。该器件针对低电压快速整流与防护应用优化，主要参数包括：正向压降 Vf = 800mV（在 IF = 100mA 时）；直流反向耐压 Vr = 30V；整流电流 IO（常规）= 200mA；反向漏电流 Ir = 2μA（在 VR = 25V、Ta = 25°C 时）；非重复峰值浪涌电流 Ifsm = 600mA。小型封装与较低的正向压降使其适合便携式与空间受限的电路板设计。
二、主要特点
- 低正向压降：100mA 工况下约 0.8V，有利于降低功耗和发热，尤其在低压供电系统中显著。
- 低反向漏流：25V 下仅约 2μA，可在电池供电或待机电路中减少静态损耗。
- 中等整流能力：200mA 连续整流电流满足多数信号与小功率电源路径需求。
- 良好浪涌能力：600mA 峰值浪涌电流，可承受短时突发电流冲击。
- SOD-123 表面贴装：体积小、易于自动化贴装与回流焊，适合批量生产和有限空间应用。
三、典型应用
- 电源反向保护与防反接电路，保护敏感负载与充电路径。
- 电源整流与二次侧保护，用于小功率开关电源、适配器和充电器。
- 电平移位与快速开关保护，在高速信号路径中减少反向恢复损耗。
- 移动设备、可穿戴设备、便携式仪器等对尺寸与待机功耗敏感的终端。
四、封装与热管理建议
SOD-123 为常见的小功率表面贴装封装，建议按照厂家推荐的 PCB 焊盘图进行布局，保证良好焊接强度与热散逸。尽管器件具有一定浪涌能力，长期工作时仍需关注结温上升，必要时通过铜箔加宽或邻近散热铜域来提升散热能力。回流焊接工艺应遵循通用的无铅焊温曲线及厂家焊接说明，避免超出温度极限影响器件可靠性。
五、使用注意事项
- 确认工作电压及最大反向电压不超过 30V；瞬态过压需额外限制或加入抑制元件。
- 在高温环境下漏电流会增加，设计时应考虑温度漂移对待机电流的影响并适当降额使用。
- 若电路中可能出现高能量浪涌，应评估 Ifsm 与实际冲击是否匹配，必要时选用更大规格器件或并联/串联保护方案（并联需注意均流问题）。
- 储存与搬运注意防静电，贴片前后按湿敏等级与回流规范处理，以防吸湿或焊接缺陷。
六、采购与技术支持
选型时请以富芯森美（FUXINSEMI）提供的最新器件数据手册为准，核对温度特性、典型曲线与包装信息。批量采购可向授权代理或原厂询价，并建议索取样品与可靠性报告进行评估测试。如需在特殊环境（高温、高湿或高频）下使用，可联系厂家技术支持获取经验数据和应用建议。
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