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FUXINSEMI BCX56-16 BCX56
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- FUXINSEMI BCX56-16
- Type
- FUXINSEMI
- Minimum package
- 1000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- FUXINSEMI
- Electronic Component
- BCX56-16
- Electronic Component
- 1
- Package
- SOT-89-3
- Electronic Component
- 1 NPN
- Electronic Component
- Transistor(BJT)
- Electronic Component
- 0.124g
- Electronic Component
- 1
- Electronic Component
- BM0230032085
- Operating Temperature
- 25℃~+125℃
- Transistor Type
- NPN
- Frequency(f T)
- 130MHz
- Power Dissipation(Pd)
- 500mW
- Electronic Component
- Electronic Component
- Electronic Component
- 1000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
BCX56-16 产品概述
一、概述
BCX56-16 是一款由 FUXINSEMI（富芯森美）推出的通用 NPN 三极管，采用 SOT-89-3 封装，面向中低功率开关与放大应用。器件在保持较高增益与宽频带特性的同时，体积小、便于贴片装配，适合便携及空间受限的电路板设计。
二、主要参数
- 晶体管类型：NPN
- 集电极电流（Ic）：1A（峰值或脉冲条件下使用需参考 SOA）
- 集—射击穿电压（Vceo）：80V
- 功耗耗散（Pd）：500mW（SOT-89-3 封装，需良好散热）
- 直流电流增益（hFE）：250（测试条件 Ic=150mA，VCE=2V）
- 特征频率（fT）：130MHz
- 集电极截止电流（Icbo）：100nA（典型）
- 集—射饱和电压（VCE(sat)）：约500mV（测试条件 IC=0.5A，IB=50mA）
- 射极—基极击穿电压（Vebo）：5V
- 工作温度范围：-25℃ ~ +125℃
三、特点与优势
- 高电压耐受：80V 的 Vceo 使其可胜任多数汽车及工业类中等电压场合的信号放大与开关。
- 高增益：在中等电流工作点（Ic=150mA）下 hFE 可达 250，适合用作小信号放大器或驱动级。
- 宽频率响应：fT≈130MHz，支持较高频率的小信号放大与增益配置。
- 小型贴片封装：SOT-89-3 便于表面贴装，适合自动化装配和体积受限设计。
四、典型应用
- 低功耗信号放大（前级放大、驱动级）
- 通用开关（逻辑电平驱动、继电器/小型负载驱动）
- 汽车电子与工业控制中的低至中等电压电路
- 高频率或宽带小信号处理电路
五、热管理与使用注意
- Pd=500mW 表明在持续高功耗条件下必须做好 PCB 热设计：建议扩展散热铜箔、采用热 vias 或将器件靠近散热面布置以降低结温。
- 虽然 Ic 标称可达 1A，但在高 VCE 或连续工作时受限于封装散热与 SOA，避免长时间在高电流高压下工作。
- Vbe/ Vebo 限制（Vebo=5V）提示在基极至射极间要控制反向电压，防止基极击穿。
- 为避免受温度影响造成 Icbo 增大，应在高温环境下考虑偏置稳定性与泄漏电流对电路的影响。
六、封装与储存
- 封装：SOT-89-3，适合表面贴装自动化生产。装板时注意焊盘与热铜箔布局以优化散热。
- 储存与处理：按通用半导体防潮与防静电规范操作。推荐在规定的干燥箱内储存及回流焊前进行必要的预烘烤处理。
总结：BCX56-16 在 SOT-89-3 小封装下提供了良好的电压耐受、高增益与较宽的频率特性，适用于中低功率放大与开关场合。设计时应重点关注热管理与工作点选择，以发挥器件的最佳性能。若需精确的电气典型曲线与 SOA 限制，请参照完整的器件数据手册。
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