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FUXINSEMI B5819WS
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- FUXINSEMI B5819WS
- Type
- FUXINSEMI
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- FUXINSEMI
- Electronic Component
- B5819WS
- Electronic Component
- 1
- Package
- SOD-323(SC-90)
- Electronic Component
- Schottky Diode
- Electronic Component
- 0.027g
- Electronic Component
- 1
- Electronic Component
- BM0264480238
- Current
- 1A
- Diode
- 1
- Current(Ir)
- 1uA
- (Vf)
- 900mV@3A
- Electronic Component
- 55℃~+150℃
- Electronic Component
- Electronic Component
- Electronic Component
- 3000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
B5819WS 产品概述
一、产品简介
B5819WS 为富芯森美（FUXINSEMI）出品的一款独立式肖特基整流二极管，采用 SOD-323（SC-90）小型封装，面向空间受限的消费电子与工业应用。器件在结温范围 -55℃ 到 +150℃ 下工作稳定，具备低正向压降与较低反向漏电的特性，适合对效率和封装体积有要求的场景。
二、主要参数（要点）
- 二极管类型：独立式肖特基二极管
- 正向压降：Vf = 900 mV @ 3 A（典型测量点）
- 最大反向耐压：Vr = 40 V
- 额定整流电流：1 A（连续）
- 反向电流：Ir = 1 μA（常温下典型）
- 非重复峰值浪涌电流：Ifsm = 9 A（短时冲击）
- 工作结温：-55℃ ~ +150℃
- 封装：SOD-323（SC-90），小型表贴
三、性能亮点
- 低正向压降：在高电流脉冲条件下依然能保持较低的能耗转换损失，有利于提升整机效率。
- 小尺寸封装：SOD-323 适合高密度 PCB 布局与便携设备应用。
- 良好的耐冲击能力：9A 的非重复峰值浪涌能力可应对短时启动或浪涌事件。
- 宽温工作范围：-55℃ 至 +150℃ 支持较严苛环境使用。
四、典型应用场景
- 开关电源输出整流与续流回路
- 低压降反向保护与极性保护（如电池供电、电源选择）
- 移动设备与便携类消费电子（体积与效率敏感）
- 工业控制与通信端口的防护电路（在 Vr 允许的电压下）
五、设计与使用建议
- 连续工作电流建议按额定 1 A 进行设计，若需要短时更高电流，可利用 Ifsm 的冲击余量；但应避免长期在 3 A 等高电流点下运行以防过热。
- 反向漏电随温度上升显著增加，高温应用需考虑热敏影响并适当降额。
- 封装体积小，焊接时建议采用推荐回流温度曲线并注意 PCB 散热铺铜，改善热阻。
- 引脚极性区分清楚，封装表面通常有阴极标志（请参阅封装图纸确认）。
本产品适合对尺寸、效率及短时浪涌能力有均衡要求的场合，详细电气特性与封装资料请参考富芯森美官方数据手册以完成最终设计验证。
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