Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
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Technical data
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
FT24C08A-KTR-T是辉芒微(FMD) 推出的一款8Kbit串行I2C接口EEPROM,属于该品牌24C系列存储芯片的基础款,主打小容量、高可靠、宽适配特性,专为需要非易失性存储的小型化电子系统设计——无需额外硬件支持即可实现参数、配置等关键数据的断电保存,是替代传统并行EEPROM的高性价比选择。
芯片标称存储容量为8Kbit(即8192位),换算为字节(Byte)为1024字节(1Byte=8bit),可满足多数小型系统的配置存储需求(如1000字节左右的设备ID、校准参数、用户设置等),避免了大容量芯片的资源浪费。
FT24C08A-KTR-T采用标准I2C串行接口,仅需两根线(SDA:数据线,SCL:时钟线)即可实现与主控芯片的通信,核心特性包括:
芯片工作温度覆盖**-40℃+85℃,属于工业级温度范围**,可适应户外、工业控制等恶劣环境(如低温环境的户外传感器、高温环境的车间控制器),比消费级0℃70℃芯片的适用场景更广泛。
采用辉芒微自研的EEPROM存储工艺,具备良好的抗电磁干扰(EMI)能力,在复杂工业环境中仍能稳定工作,数据读写误码率极低;同时支持写保护功能(WP引脚),可避免误操作导致的数据擦除。
采用TSSOP-8封装(薄型小尺寸封装),尺寸约为4.4mm×3.0mm×1.0mm,体积仅为传统DIP-8封装的1/5左右,适合小型化、高密度PCB设计(如智能穿戴、小型控制器)。
FT24C08A-KTR-T凭借宽电压适配、高速通信、高可靠性三大核心优势,以及小体积TSSOP-8封装,成为小型化电子系统中非易失性存储的高性价比选择。其覆盖工业级温度范围、100年数据保留和100万次写寿命,可满足多数场景下的长期稳定存储需求,适合对成本敏感且需要可靠存储的应用设计。
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Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
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