WMSIC Electronic Components

FMD FT24C04A-KLR-T FT24C04A

ModelFT24C04A-KLR-T
PackageSOT-23-5
BrandFMD
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
FMD FT24C04A-KLR-T
Type
FMD
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
FMD
Electronic Component
FT24C04A-KLR-T
Electronic Component
1
Package
SOT-23-5
Electronic Component
EEPROM
Electronic Component
0.041g
Electronic Component
1
Electronic Component
BM0264576603
Electronic Component
4Kbit
Operating Temperature
40℃~+85℃
Operating Voltage
1.8V~5.5V
Interface Type
I2C
Electronic Component
100
Clock Frequency(fc)
1MHz
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

FT24C04A-KLR-T 产品概述

一、产品简介

FT24C04A-KLR-T 为 FMD(辉芒微)推出的一款 I2C 总线串行 EEPROM,存储容量 4Kbit(512 字节),采用 SOT-23-5 小封装,适合对体积、功耗和可靠性有较高要求的嵌入式存储场景。器件支持 1.8V–5.5V 宽电源电压范围、最高 1MHz 的 I2C 时钟频率,并提供硬件写保护与噪声抑制功能,适用于消费电子、工业控制、仪表与可穿戴设备等多类应用。

二、主要规格(概要)

  • 存储容量:4Kbit(512 字节)
  • 接口类型:I2C(标准串行接口),最高时钟频率 fc = 1 MHz
  • 工作电压:1.8 V 至 5.5 V(宽电源范围)
  • 工作温度范围:-40 ℃ ~ +85 ℃
  • 写周期时间(Tw):典型 5 ms(从写入到内部完成写操作所需时间)
  • 写周期寿命(耐久性):1,000,000 次写入周期
  • 数据保持(TDR):100 年(典型数据保持时间)
  • 封装:SOT-23-5
  • 品牌/型号:FMD(辉芒微) / FT24C04A-KLR-T
  • 特色:硬件写保护、噪声抑制

三、关键特性与优势

  • 宽电压兼容:1.8V–5.5V 电源范围可直接与不同电压域的 MCU 或传感器连接,简化电源设计与系统集成。
  • 高速 I2C 支持:最高 1 MHz 时钟,满足实时性要求更高的系统访问需求,适合多设备共享总线的场景。
  • 高可靠性:写入耐久性高达 100 万次,数据保持时间长达 100 年,适合长期数据保存与频繁写更新场合。
  • 硬件写保护:提供外部硬件写保护功能,方便对关键设置或校准数据实施物理级别的写操作禁止。
  • 噪声抑制:内建噪声抑制电路,提高总线抗干扰能力,适合电磁环境复杂或布线紧凑的系统。
  • 小体积封装:SOT-23-5 适合空间受限的应用,如便携设备、智能传感器模块。

四、引脚与封装说明(通用说明)

FT24C04A-KLR-T 采用 SOT-23-5 封装,常见引脚功能包括 VCC(电源)、GND(地)、SCL(时钟)、SDA(数据)、WP(写保护)。为确保正确连接与使用,请以正式数据手册中的引脚图为准;下列为典型布线要点:

  • VCC 与 GND 之间建议放置 0.1 μF 陶瓷去耦电容,靠近芯片引脚以抑制瞬态噪声。
  • SDA 与 SCL 总线上需使用上拉电阻(按系统总线长度和工作电流选择,常见范围 2.2 kΩ–10 kΩ)。
  • WP(写保护)引脚用于启用/禁用写保护,具体的电平定义和功能请参见数据手册并在系统设计中明确其默认态。

五、典型应用场景

  • 系统配置与参数存储:保存设备出厂参数、校准系数、序列号等永久性或半永久性数据。
  • 消费电子与可穿戴设备:小容量配置信息存储、历史记录或设备标识。
  • 工业与仪表:数据记录、设备标识与防篡改存储(结合写保护使用)。
  • 物联网终端:节点配置与密钥存储(结合系统级安全设计)。

六、设计与使用建议

  • 电源滤波与去耦:VCC 与 GND 之间放置 0.1 μF 陶瓷电容,并根据系统需求在电源入口增加合适滤波元件,降低电源噪声对 EEPROM 的影响。
  • I2C 总线设计:根据总线负载与速度选择上拉电阻;高速(接近 1 MHz)工作时建议使用较低阻值以保证边沿速率,但会增加功耗。
  • 写操作优化:因写周期典型为 5 ms,建议在批量写入场景中采用页写(若支持)或合并写操作以提高效率并降低写入次数。
  • 写保护策略:在需要防止意外或恶意写入时,将 WP 拉到写保护状态;在需要更新时短时释放写保护以进行合法写操作。
  • 抗干扰与布线:SDA/SCL 线尽量缩短并采用合理阻抗匹配,避免与高频或高电流线并行走线;必要时在总线两端或芯片附近增加 RC 抑制。

七、可靠性与采购信息

FT24C04A-KLR-T 由 FMD(辉芒微)提供,SOT-23-5 小封装利于批量贴片与自动化组装。器件具备工业级温度范围与长期数据保持能力,适合对可靠性有较高要求的商业与工业产品。在选型与生产前,建议参照完整数据手册确认引脚定义、电气特性、时序和封装尺寸,并进行必要的系统级验证与环境测试。若需替代型号、样品或大批量采购,建议联系 FMD 官方渠道或授权分销商获取最新供应与技术支持资料。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.