WMSIC Electronic Components

FMD FT60F210-URT FT60F210

ModelFT60F210-URT
PackageSOT-23-6
BrandFMD
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
FMD FT60F210-URT
Type
FMD
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
FMD
Electronic Component
FT60F210-URT
Electronic Component
1
Package
SOT-23-6
Electronic Component
MCU(MCU / MPU / SOC)
Electronic Component
0.043g
CPU
Other
I / O
4
Electronic Component
1
Electronic Component
BM0264240411
Operating Voltage
1.9V~5.5V
CPU
16MHz
Electronic Component
Electronic Component
Electronic Component
3000
Electronic Component
1KB

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

FT60F210-URT 单片机产品概述

FT60F210-URT是辉芒微(FMD)推出的一款超小型8位精简指令集(RISC)单片机,专为空间受限、低功耗且功能需求简单的应用场景设计,凭借紧凑封装、宽电压适配和高性价比成为小型电子设备的理想控制核心。

一、核心性能与架构

该芯片采用8位RISC内核,具备16MHz最大工作主频,指令集精简高效,单周期指令执行速度快,能够满足基础逻辑控制、状态监测等快速响应需求。内核设计优化了功耗与性能的平衡,在低主频模式下可进一步降低功耗,适配电池供电场景,避免不必要的能量消耗。

二、存储资源配置

FT60F210-URT配备1KB FLASH程序存储器,支持1000次以上擦写循环,数据保存时间可达10年,适合需要固件更新的小型应用(如模式切换、参数微调);同时内置64Byte SRAM,用于临时数据存储(如变量缓存、寄存器状态记录),精准匹配低复杂度运算需求,避免资源浪费。

三、I/O与封装特性

芯片提供4个多功能I/O引脚,可配置为数字输入、推挽输出或开漏输出,部分引脚支持复用功能(如模拟信号采集),灵活适配LED指示、按键输入、传感器信号处理等场景。封装采用SOT-23-6,尺寸仅约2.9×1.6mm,是典型的超小型贴片封装,极大节省PCB布局空间,适合便携设备、小型模块等空间受限场景。

四、电源与工作环境

工作电压范围为1.9V~5.5V,覆盖3V纽扣电池、5V直流电源等常见供电方式,无需额外稳压电路即可稳定工作;工作温度范围为**-40℃~85℃**,满足工业级环境的温度波动要求,也可适配消费类电子的常规使用场景。此外,芯片具备低功耗模式(待机、休眠),进一步延长电池供电设备的续航时间。

五、典型应用场景

FT60F210-URT的特性使其在以下场景中表现突出:

  1. 便携电子配件:智能手环的辅助状态灯控制、蓝牙耳机的充电指示模块;
  2. 小型传感器节点:温湿度传感器、光照传感器的信号采集与简单处理;
  3. 家电控制子模块:遥控器的按键扫描与指令编码、小型加湿器的定时功能;
  4. 工业小型监测:小型电机的启停控制、设备状态指示灯驱动;
  5. 消费类电子:USB小夜灯的模式切换(常亮/呼吸/闪烁)、充电器的状态显示。

六、产品优势总结

  1. 空间高效:SOT-23-6超小型封装,适配高密度PCB设计,降低系统体积;
  2. 宽压适配:1.9V~5.5V供电范围,无需稳压,简化电路设计并降低成本;
  3. 性价比突出:小容量存储满足基础需求,成本远低于高配置单片机;
  4. 响应快速:16MHz主频+RISC内核,单周期指令执行,满足实时控制需求;
  5. 可靠性高:FLASH存储稳定,宽温范围适配复杂环境,长期工作无故障。

FT60F210-URT以其紧凑设计、灵活功能和高性价比,成为小型电子设备中替代复杂单片机的优选方案,尤其适合对成本、空间敏感的入门级应用。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.