WMSIC Electronic Components

FMD FT62F13F-MRB FT62F13F

ModelFT62F13F-MRB
PackageMSOP-10
BrandFMD
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

18 specifications

Core information

Product name
FMD FT62F13F-MRB
Type
FMD
Minimum package
10000 管

Technical parameters

Electronic Component
Electronic Component
Electronic Component
FMD
Electronic Component
FT62F13F-MRB
Electronic Component
1
Package
MSOP-10
Electronic Component
MCU(MCU / MPU / SOC)
Electronic Component
0g
CPU
8 bit
CPU
RISC
RAM
256Byte
Electronic Component
1
Electronic Component
BM0265086927
CPU
16MHz
Electronic Component
Electronic Component
Electronic Component
10000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

FT62F13F-MRB 产品概述

一、主要特性

FT62F13F-MRB 是一款面向低功耗、低成本嵌入式控制的单片机(MCU),采用轻量级 RISC 结构,最高主频 16MHz,片内程序存储采用 3KB Flash,数据存储约 256 字节,模数转换器为 12bit,封装为 MSOP-10。器件定位于资源受限但对模拟采样精度有一定要求的小型控制与采集场景。

二、核心资源与性能

该芯片以 16MHz 的最高频率提供稳定的运行能力,3KB 的 Flash 存储空间适合实现小型固件、简单协议栈或引导加载逻辑。约 256Byte 的内部数据存储(SRAM)适合保存运行时变量与短期缓冲。12bit ADC 提供较高分辨率的模拟量采样能力,能满足电池监测、温湿度传感器等对精度有要求的应用。

三、外设与接口

FT62F13F-MRB 在有限资源下仍提供常用外设接口,以支持多种应用需求。典型支持项包括多路 GPIO、模拟输入(12bit ADC)、定时器/看门狗等基础外设,以及可用于串行通讯的通用接口(如 UART/SPI/I2C,具体支持以数据手册为准)。这些外设组合便于实现传感器采集、简单驱动与通信功能。

四、封装与机械特性

器件采用 MSOP-10 小封装(10 引脚),体积紧凑,适合空间受限的模块化或便携式产品。MSOP-10 的焊接与 PCB 布局成熟可靠,适合批量化生产和 SMT 装配,便于在消费电子、便携测量设备或小型控制板中应用。

五、典型应用场景

  • 便携式测量仪器:借助 12bit ADC 实现高精度传感器采样与电池监测;
  • 简易控制与驱动:家电小模块、按钮/指示灯控制、继电器驱动等;
  • 低功耗传感器节点:有限 Flash 与 SRAM 足以运行轻量固件与简单通信协议;
  • 教育与开发板:作为入门级 MCU 教学或功能验证平台。

六、设计与使用建议

由于 Flash 与 SRAM 资源有限,建议精简代码与数据结构,采用紧凑型 C 语言或汇编优化关键路径;合理利用中断与低功耗模式降低功耗;在 ADC 使用上做好采样电路设计与滤波,并进行软件校准以充分发挥 12bit 分辨率。项目开发前请参考完整数据手册,获取引脚定义、电气参数和时序要求,以确保系统稳定可靠。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.