Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
FMD FT61F0A3-RB FT61F0A3
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
18
specifications
Core information
- Product name
- FMD FT61F0A3-RB
- Type
- FMD
- Minimum package
- 5000 管
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- FMD
- Electronic Component
- FT61F0A3-RB
- Electronic Component
- 1
- Package
- SOP-16
- Electronic Component
- MCU(MCU / MPU / SOC)
- Electronic Component
- 0g
- CPU
- RISC
- RAM
- 1KB
- Electronic Component
- 1
- Electronic Component
- BM0264888271
- CPU
- 16MHz
- Electronic Component
- Electronic Component
- Electronic Component
- 5000
- Memory Type
- FLASH
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
FT61F0A3-RB 产品概述
一、产品简介
FT61F0A3-RB 是辉芒微（FMD）推出的一款低功耗、成本友好的单片微控制器（MCU），封装为 SOP-16，适合空间受限且对功能有基本要求的嵌入式应用。该器件采用精简指令集（RISC）架构，工作电压范围宽（1.9V～5.5V），在多电压系统和电池供电场景中具有良好适配性。
二、主要特性
- 程序存储：内置 10KB FLASH，用于固件存放与现场升级。
- 数据存储：典型片内工作 RAM 约 1KB（请以正式数据手册为准）。
- ADC：12-bit 分辨率模数转换器，满足较高精度的模拟量采集需求。
- 电源：工作电压 1.9V～5.5V，支持 1.8V 低压系统与 5V 传统系统兼容。
- 封装：SOP-16，利于手工焊接与中小批量生产。
三、电气与存储参数（要点）
FT61F0A3-RB 将 FLASH 程序空间与片上 RAM 结合，适合用于控制型和测量型固件。12-bit ADC 提供 4096 级量化分辨率，适合温度、压力、电池电量等中小范围传感测量。宽电压特性利于直接从电池、USB 或系统 5V 供电中取电，降低外部电源电路复杂度。
四、封装与引脚说明
SOP-16 封装提供了 16 个引脚，具体引脚分配（电源、复位、模拟输入、IO 复用等）请参照器件数据手册。引脚复用灵活，实际可用 GPIO 数量取决于外设启用情况。SOP-16 形式适合通过波峰焊或手工焊接工艺进行装配和调试。
五、典型应用场景
- 便携式电池供电设备（电量监测、按键/状态控制）
- 传感器节点与数据采集单元（温湿度、光照、电压采样）
- 简单工业控制与家电控制器（按键、指示灯、基本 PWM/ADC 控制）
- 教育、开发板与中低成本消费电子产品
六、设计与使用建议
- 电源去耦：在 VCC 与 GND 之间放置适当的旁路电容（如 0.1μF）以抑制瞬态噪声。
- 复位与上电：采用稳健的复位电路或使用片上复位（BOD/ POR）功能以保证上电可靠性。
- ADC 参考：确定 ADC 参考源（内部或外部），并对模拟输入做抗混叠与阻抗匹配。
- 引脚保护：若连接大电流或高压外设，建议使用限流电阻或 TVS 二极管保护 IO。
- 调试编程：参考厂商提供的编程与调试接口以及烧录工具，做好固件升级策略。
七、注意事项与资料获取
在设计前应下载并仔细阅读 FT61F0A3-RB 的官方数据手册与参考设计，确认外设时序、电气极限、温度范围与编程协议等详细参数。对于关键应用，建议在目标系统中进行完整的 EMC、温度与老化测试，确保长期可靠性。厂家技术支持可提供引脚说明、参考电路与软件例程，便于快速开发与量产。
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