WMSIC Electronic Components

FMD FT60F122A-RB FT60F122A

ModelFT60F122A-RB
PackageSOP-14
BrandFMD
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
FMD FT60F122A-RB
Type
FMD
Minimum package
5000 管

Technical parameters

Electronic Component
Electronic Component
Electronic Component
FMD
Electronic Component
FT60F122A-RB
Electronic Component
1
Package
SOP-14
Electronic Component
MCU(MCU / MPU / SOC)
Electronic Component
0.338g
CPU
Other
I / O
12
Electronic Component
1
Electronic Component
BM0264899337
Operating Voltage
1.9V~5.5V
CPU
16MHz
Electronic Component
Electronic Component
Electronic Component
5000
Electronic Component
2KB

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

FT60F122A-RB 8位RISC单片机产品概述

FT60F122A-RB是辉芒微(FMD)针对小型控制场景推出的高性价比8位单片机,采用自主研发的RISC架构,以均衡的存储资源、宽电压适配、小体积封装为核心优势,广泛应用于消费电子、小型工业控制等领域。

一、核心架构与性能基础

该型号搭载辉芒微自主8位RISC内核,指令集设计高效,单周期指令占比达90%以上,配合最大16MHz工作主频,运算性能优于传统8位CISC架构单片机,可满足中低速控制逻辑的实时响应需求。
工作温度范围覆盖**-40℃~85℃**(工业级标准),能适应不同环境下的稳定运行,避免极端温度对系统的影响。

二、存储资源配置

2.1 程序存储器

内置2KB FLASH程序存储器,支持在线编程(ISP) 和在线调试(ICP),无需专用编程器即可完成固件烧写,便于产品批量生产与后期固件升级;FLASH擦写次数≥1000次,数据保持时间≥10年,可靠性符合工业级标准。

2.2 数据存储器

配备128Byte SRAM作为数据缓存,足够支撑小型程序的变量存储、堆栈操作,可满足LED驱动、按键扫描、简单电机控制等基础应用的内存需求。

三、I/O与基础外设特性

3.1 I/O引脚

采用SOP-14封装,共12个通用I/O引脚(扣除电源、复位等功能脚),每个引脚可配置为:

  • 输入/输出模式;
  • 上拉/下拉电阻(软件可选);
  • 外部中断输入(部分引脚支持INT0/INT1中断,响应外部事件触发)。

引脚兼容性强,可直接替换同类小封装单片机,降低方案设计难度。

3.2 基础外设

内置看门狗定时器(WDT),可配置1ms~1s的溢出时间,防止程序因干扰跑飞,提升系统可靠性;同时支持定时器/计数器(1个16位核心定时器+1个8位辅助定时器),满足定时中断、脉冲计数等需求。

四、电源与低功耗设计

4.1 宽电压适配

工作电压范围为1.9V~5.5V,覆盖常见电源场景:

  • 电池供电:纽扣电池(3V)、干电池(1.5V×2=3V);
  • 系统供电:5V直流电源(如USB 5V)。
    无需额外稳压电路,简化硬件设计。

4.2 低功耗模式

支持休眠模式和空闲模式,休眠模式下待机电流低至1μA以下(典型值),可大幅延长电池供电设备的续航时间,适合便携类应用。

五、封装与典型应用场景

5.1 封装形式

SOP-14封装体积小巧(引脚间距1.27mm),焊接兼容性强,适合PCB板空间受限的场景(如小型家电、玩具控制模块),可通过自动化贴装提高生产效率。

5.2 典型应用

凭借成本优势与资源均衡性,FT60F122A-RB广泛应用于:

  • 消费电子:小型加湿器、智能小夜灯、玩具控制;
  • 工业控制:传感器节点、小型电机驱动;
  • 便携设备:低功耗智能穿戴辅助模块、电池供电的小型监测设备。

该型号以稳定的性能、灵活的适配性,成为低成本小型控制方案的优选器件,适合对成本敏感且无需复杂外设的应用场景。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.