WMSIC Electronic Components

FMD FT61F0A5-TRB FT61F0A5

ModelFT61F0A5-TRB
PackageTSSOP-20
BrandFMD
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
FMD FT61F0A5-TRB
Type
FMD
Minimum package
7000 管

Technical parameters

Electronic Component
Electronic Component
Electronic Component
FMD
Electronic Component
FT61F0A5-TRB
Electronic Component
1
Package
TSSOP-20
Electronic Component
MCU(MCU / MPU / SOC)
Electronic Component
0.178g
CPU
RISC
I / O
18
RAM
1KB
Electronic Component
1
ADC
12bit
EEPROM
128Byte
Electronic Component
BM0264888272
Operating Temperature
40℃~+85℃
Operating Voltage
1.9V~5.5V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

FT61F0A5-TRB 单片机产品概述

FT61F0A5-TRB是辉芒微(FMD) 推出的一款高性价比RISC架构单片机(MCU),针对低功耗、小型化控制场景设计,集成核心数字/模拟外设,兼顾性能与成本控制,适用于多种消费电子及小型工业应用。

一、产品核心定位与设计思路

该MCU聚焦**“小容量、高集成、低成本”** 核心需求,采用精简指令集(RISC)内核降低指令执行功耗,同时整合12bit ADC、18路GPIO等常用外设,无需额外扩展芯片即可满足基础控制与信号采集需求。其宽电压范围(1.9V~5.5V)及TSSOP-20小封装,进一步适配电池供电、PCB布局紧凑的产品设计。

二、硬件参数详细解析

1. 内核与存储

  • 内核架构:采用RISC精简指令集内核,指令周期短,执行效率高,适合低功耗场景下的快速响应;
  • 程序存储:10KB FLASH程序存储器,支持在线编程(ISP)与重复擦写,便于开发调试及产品程序更新;
  • 数据存储:1KB RAM数据存储器,满足临时变量、运算结果等基础数据存储需求。

2. 模拟与数字外设

  • 模拟外设:集成12bit分辨率ADC,转换精度满足常见传感器(如温湿度、光强)的信号采集需求,可通过GPIO复用实现多路模拟输入;
  • 数字外设:18个通用输入输出(GPIO)端口,支持数字输入、输出、中断触发等功能,可灵活配置为推挽输出、开漏输出或输入模式,适配不同外设连接。

3. 工作特性

  • 电压范围:1.9V~5.5V宽电压工作,覆盖纽扣电池(3V)、干电池(4.5V)及5V电源等常见供电场景,无需额外电源转换电路;
  • 温度范围:支持-40℃~85℃工业级温度范围(典型值),适应户外或复杂环境下的稳定运行;
  • 功耗表现:RISC内核及低功耗设计,适合电池供电的低功耗应用(如小型便携设备)。

三、典型应用场景

FT61F0A5-TRB的核心特性使其适配多种小型控制与信号采集场景:

  1. 小型家电控制:如加湿器、小型风扇、电动牙刷的开关控制、定时逻辑及状态反馈;
  2. 传感器监测系统:温湿度传感器、光强传感器、压力传感器的信号采集与简单处理;
  3. 消费电子配件:蓝牙低功耗(BLE)模块的辅助控制、小型玩具的动作驱动;
  4. 工业辅助设备:小型电机的启停控制、状态指示灯的逻辑控制、小型仪表的显示驱动。

四、封装与可靠性

采用TSSOP-20封装,引脚间距0.65mm,封装尺寸紧凑(典型值:6.4mm×4.4mm),适合PCB布局紧凑的产品设计;封装符合工业级可靠性标准,具备良好的抗静电(ESD)、抗电磁干扰(EMI)能力,可稳定应用于一般电子系统。

五、选型优势总结

  1. 成本控制优异:小容量存储+核心外设集成,无需额外扩展芯片,批量应用成本优势明显;
  2. 电源适配灵活:1.9V~5.5V宽电压覆盖多种供电场景,简化电源设计;
  3. 开发调试便捷:FLASH支持在线编程,开发周期短,程序更新灵活;
  4. 小封装适配性强:TSSOP-20封装适合小型化产品,节省PCB空间。

FT61F0A5-TRB作为一款高性价比RISC MCU,在基础控制、信号采集等场景中可替代同类产品,平衡性能与成本,是小型电子系统设计的优选方案之一。

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