WMSIC Electronic Components

FMD FT61F135-TRB FT61F135

ModelFT61F135-TRB
PackageTSSOP-20
BrandFMD
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
FMD FT61F135-TRB
Type
FMD
Minimum package
7000 管

Technical parameters

Electronic Component
Electronic Component
Electronic Component
FMD
Electronic Component
FT61F135-TRB
Electronic Component
1
Package
TSSOP-20
Electronic Component
MCU(MCU / MPU / SOC)
Electronic Component
0.183g
CPU
RISC
I / O
18
RAM
256Byte
Electronic Component
1
ADC
12bit
EEPROM
128Byte
Electronic Component
BM0264253112
Operating Temperature
40℃~+85℃
Operating Voltage
1.9V~5.5V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

FT61F135-TRB 单片机产品概述

一、核心架构与性能基础

FT61F135-TRB采用辉芒微自研RISC精简指令集内核,具备16MHz最高工作主频,指令执行效率高、功耗低,是小型嵌入式控制场景的核心选择。该内核支持单周期指令执行(分支指令除外),可快速响应外部事件,满足非高实时性的控制需求,同时简化程序编译与调试流程。

二、存储资源配置

设备内置3KB FLASH程序存储器,支持在线编程(ICP)与在线调试(ICD),方便后期程序升级;搭配256Byte SRAM数据缓存,可满足小型控制程序的变量存储需求。FLASH具备10万次擦写寿命与20年数据保存期,保障程序长期稳定运行,无需担心数据丢失。

三、接口与外设功能

3.1 GPIO资源

提供18个通用输入输出端口(GPIO),每个端口支持上下拉电阻配置、中断触发(上升沿/下降沿/双边沿),可直接驱动小功率LED、蜂鸣器,或采集按键、开关量输入信号,减少外部电路的额外元件,降低设计成本。

3.2 ADC模块

集成12bit分辨率逐次逼近型ADC,支持多路模拟信号采集(TSSOP-20封装下适配多通道),采样精度满足温度、湿度、光照等模拟传感器的信号转换需求,无需外接高精度ADC即可实现模拟量检测,简化信号采集电路。

3.3 定时器外设

内置多组8位/16位定时器,支持定时中断、PWM输出功能,可用于LED呼吸灯控制、电机转速调节、定时唤醒等场景,进一步丰富设备的控制能力,适配多样化应用需求。

四、封装与工作特性

采用TSSOP-20薄型小尺寸封装,引脚间距0.65mm,体积小巧(封装尺寸约4.4mm×6.4mm),适合空间紧凑的PCB设计(如小型家电、便携设备)。工作电压范围为1.9V~5.5V,覆盖纽扣电池(3V)、锂电池(3.7V)及传统5V电源,无需额外稳压电路即可适配多种供电场景;同时具备低功耗模式(如休眠模式),可延长电池供电设备的续航时间。

五、典型应用场景

FT61F135-TRB凭借高性价比与丰富外设,广泛应用于:

  1. 小型家电控制:加湿器、小夜灯、电蚊拍等核心控制单元;
  2. 消费电子配件:蓝牙音箱辅助控制、智能手环辅助模块;
  3. 工业小型节点:温湿度传感器节点、小型数据采集器;
  4. 玩具与礼品:遥控玩具、电子贺卡的控制芯片;
  5. 智能家居单品:智能插座、智能开关的简单控制模块。

六、开发与选型说明

该型号兼容辉芒微同系列开发工具(如FT600系列编程器、FMD IDE开发环境),支持C语言与汇编语言开发,入门门槛低。若需更大存储容量或更多外设,可兼容同系列引脚封装的升级型号(如FT61F140),方便产品迭代。需注意:TSSOP-20封装与部分同引脚数的其他品牌MCU(如STM8S003F3)引脚功能存在差异,选型时需核对电路匹配性。

FT61F135-TRB以其均衡的性能、丰富的外设与高性价比,成为小型嵌入式控制领域的实用选择,适配多种低成本、低复杂度的应用场景。

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