WMSIC Electronic Components

GOODWORK B5819WS

ModelB5819WS
PackageSOD-323
BrandGOODWORK
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
GOODWORK B5819WS
Type
GOODWORK
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
GOODWORK
Electronic Component
B5819WS
Electronic Component
1
Package
SOD-323
Electronic Component
Schottky Diode
Electronic Component
0.029g
Electronic Component
1
Electronic Component
BM0230812395
Current
1A
Diode
Electronic Component
Current(Ir)
50uA
(Vf)
550mV@1A
Electronic Component
65℃~+125℃
Electronic Component
Electronic Component
Electronic Component
3000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

B5819WS 产品概述

一、产品简介

B5819WS(品牌:GOODWORK / 固得沃克)是一款独立式肖特基整流二极管,采用小型SOD-323封装,面向对体积和开关损耗有严格要求的低压电源与保护电路。该器件在1A工作电流下具有典型正向压降约0.55V,配合低反向恢复与较低的反向漏电,能够提升系统效率并缩小散热需求。

二、主要电气参数

  • 正向压降(Vf):0.55V @ If = 1A(典型值)
  • 直流反向耐压(Vr):40V
  • 整流电流(If(AV)):1A
  • 反向电流(Ir):50µA(常见测试条件下)
  • 非重复峰值浪涌电流(Ifsm):25A(半波冲击)
  • 工作结温范围:-65℃ ~ +125℃

这些参数表明该器件适合在低压至中低压场合做整流、续流或保护用途,但在高温环境下需关注反向漏电与散热降额。

三、封装与热管理

SOD-323封装体积小、适合高密度贴装,但封装热阻相对较高。建议在PCB设计时:

  • 在二极管下方或引脚周围增加铜箔散热面积(热过孔或大面积铜箔);
  • 对承载1A持续电流的走线采取宽线或多层铜平铺;
  • 若存在反复冲击电流或高环境温度,应做热仿真并适当降额使用。

四、典型应用场景

  • 开关电源输出整流与输入保护
  • 电源极性保护与反向防护电路
  • 续流二极管(例如MOSFET开关负载回路)
  • 小型充电器、适配器以及多种便携式电子设备的电路保护

五、使用建议与注意事项

  • 注意Vr=40V的绝对限制,避免长期承受超过额定电压的脉冲或纹波;
  • 反向漏电会随温度显著上升,高温场合应考虑降额或选择漏电更低的器件;
  • Ifsm为非重复峰值,发生浪涌时应保证脉冲宽度及次数在器件规格范围内;
  • 焊接时遵循推荐回流曲线,避免因过热影响器件可靠性;
  • 设计中可配合吸收/缓冲电路(如RC或TVS)限制浪涌和减小电压尖峰。

六、采购与替代

订购时请确认完整型号“GOODWORK B5819WS,SOD-323封装”并索取正式数据手册以核对测试条件。对于需更高耐压或更大电流的场合,可考虑同家或其他厂商的高压/大电流肖特基替代型号,但需评估正向压降、漏电、封装热阻等差异。

如需我提供用于PCB布局的参考封装尺寸、典型电气曲线或与常见替代型号的对比表,可继续说明具体需求。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.