WMSIC Electronic Components

GOODWORK SS56

ModelSS56
PackageSMA(DO-214AC)
BrandGOODWORK
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
GOODWORK SS56
Type
GOODWORK
Minimum package
2000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
GOODWORK
Electronic Component
SS56
Electronic Component
1
Package
SMA(DO-214AC)
Electronic Component
Schottky Diode
Electronic Component
0.093g
Electronic Component
1
Electronic Component
BM0230812389
Current
5A
Diode
Electronic Component
Current(Ir)
100uA
(Vf)
700mV@5A
Electronic Component
65℃~+150℃
Electronic Component
Electronic Component
Electronic Component
2000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

SS56(GOODWORK 固得沃克)产品概述

一、产品简介

SS56 是一款 GOODWORK(固得沃克)品牌的独立式肖特基整流二极管,采用 SMA(DO-214AC)表面贴装封装,面向中低压大电流整流与开关应用。该器件在额定直流整流电流 5A 条件下表现出较低的正向压降和快速恢复特性,适合开关电源、桥式整流、同步整流替代及反向保护等场景。

二、主要电气参数

  • 二极管配置:独立式(单只肖特基二极管)
  • 正向压降(Vf):700 mV @ 5 A(典型/额定条件下)
  • 直流反向耐压(Vr):60 V
  • 直流整流电流(If):5 A
  • 非重复峰值浪涌电流(Ifsm):120 A(一次性浪涌能力,用于器件承受瞬态冲击)
  • 反向电流(Ir):100 µA(规格表列示值,反向漏电随温度升高而增加)
  • 结温范围:-65 ℃ ~ +150 ℃

以上参数反映了 SS56 在中等电压与大电流条件下的典型性能,能够在紧凑封装中实现较好的导通损耗/热性能平衡。

三、封装与热管理

SS56 采用 SMA(DO-214AC)封装,特点如下:

  • 适合自动化贴装,体积小,利于高密度 PCB 设计。
  • 封装具有良好的焊接可靠性及机械强度,适合常见的波峰/回流焊工艺。
    关于热管理:
  • 5A 连续整流条件下,器件发热不可忽视,应通过增大 PCB 铜箔面积(散热垫或散热层)、良好的过孔布局与靠近散热体安装等方式降低结温。
  • 非重复峰值浪涌(Ifsm 120A)为短时承受能力,不宜作为重复工作条件,避免在重复高浪涌下损伤器件。

四、典型应用

  • 开关电源(SMPS)输出整流、二次侧整流。
  • 桥式整流与输入整流,适用于中小功率电源模块。
  • 反向电源保护(防反接)和反并联防止反向电流。
  • 电池充电器与太阳能控制器中的低压整流场景。
  • 作为功率开关或 MOSFET 的免费轮回二极管(flyback/clamping)替代件,利用肖特基的快速响应与低反向恢复。

五、优点与使用注意事项

优点:

  • 低正向压降(700 mV @ 5 A),减少导通损耗,提高转换效率。
  • 肖特基结构无 PN 级正向恢复,具备更快的开关特性和较小的开关损耗。
  • SMA 封装兼顾散热与体积,便于装配与维护。

注意事项:

  • 反向漏电随温度升高显著上升,在高温环境下应关注 Ir 对系统待机损耗或漏电保护的影响。
  • Ifsm 为非重复峰值浪涌指标,仅能承受短脉冲,重复冲击会导致热失效。
  • 在 60 V 反向电压附近工作时,需留出足够安全裕量,以应对瞬态过压。
  • 为保证可靠性,设计时应控制结温在可靠范围内,避免长期高温运行。

六、可靠性与环境适应性

器件工作结温范围宽(-65 ℃ 到 +150 ℃),说明其在工业级与部分严苛环境中具有较好的适应性。SMA 封装经过常规的热循环、振动及机械应力检验,适合工业类电源与车用电子中的某些低到中等级别场景。系统设计时仍建议按规格书中的热特性及寿命曲线评估长期可靠性。

七、推荐电路与使用建议

  • 对于输出整流,建议将 SS56 放置于靠近滤波电容的一侧,缩短回流路径,降低 EMI。
  • 在高功率应用中,通过加宽地铜箔、增加“散热焊盘”及多点过孔连接来分散热量。
  • 若系统对待机漏电严格要求,应在电路中加入补偿或并联低漏电元件以控制总体漏电。
  • 在需要更低导通压降或更高电压耐受的场景,可考虑并联多只器件或选用额定更高的型号,但并联时需注意电流分流与热均衡问题。

总结:GOODWORK 的 SS56 在 SMA 小型封装下提供了 5A 连续整流能力、60V 反向耐压与 120A 峰值浪涌承受能力,适用于多种中低压电源整流及保护应用。合理的热设计与考虑漏电特性可进一步发挥其性能优势。

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