WMSIC Electronic Components

GOODWORK SI2309

ModelSI2309
PackageSOT-23
BrandGOODWORK
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
GOODWORK SI2309
Type
GOODWORK
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
GOODWORK
Electronic Component
SI2309
Electronic Component
1
Package
SOT-23
Electronic Component
1 P
Type
P
Electronic Component
MOSFET
Electronic Component
0.034g
Electronic Component
1
Electronic Component
BM0263571089
Operating Temperature
55℃~+150℃
Power Dissipation(Pd)
1.56W
Electronic Component
Electronic Component
Electronic Component
3000
Voltage(Vdss)
60V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

SI2309 产品概述

SI2309 是 GOODWORK(固得沃克)出品的一款低功耗 P 沟道场效应管,面向电源开关与信号控制等应用场景。器件采用 SOT-23 小封装,适合便携设备与空间受限的电路板设计,具有较低的导通电阻和适中的电压、电流等级,便于在开关、保护与反向供电等电路中实现可靠控制。

一、主要特性

  • 类型:P 沟道 MOSFET(便于实现高端开关和负载断开控制)
  • 漏源电压 Vdss:60 V(适用于中低压边沿开关应用)
  • 连续漏极电流 Id:2 A(在合适的散热条件下可驱动中小功率负载)
  • 导通电阻 RDS(on):160 mΩ @ 10 V(标称值)
  • 阈值电压 Vgs(th):1.9 V(典型值,表示器件开始导通的电压阶梯,P 型器件在使用时注意栅源极性)
  • 功耗 Pd:1.56 W(封装热限制下的最大耗散功率)
  • 栅极电荷 Qg:8.2 nC @ 10 V(反映开关速度与驱动能力需求)
  • 输入电容 Ciss:425 pF,输出电容 Coss:35 pF,反向传输电容 Crss:20 pF(影响开关转换时的过渡特性)
  • 工作温度范围:-55 ℃ ~ +150 ℃
  • 封装:SOT-23(适合小型化应用)

二、电性能要点说明

  • P 沟道器件在高端开关(连接电源正端)与反向保护、负载断开等电路中使用方便,栅极相对于源极需要施加负向电压以完全开启。
  • RDS(on) 的标称值在 VGS=10 V 条件下测得,实际电路中若栅压幅值不足,导通电阻会显著上升,导致更高的功耗与发热。
  • 较大的栅极电荷 Qg 表明在高速开关场合需要考虑驱动能力与驱动损耗;驱动器或 MCU 在切换过程中需提供足够的电荷/电流,以保证切换速度与降低过渡损耗。
  • Ciss、Coss、Crss 三项电容决定了开关瞬态过程中的能量转移与振铃特性,合理布局与串联阻尼有利于抑制干扰与过冲。

三、典型应用场景

  • 电源高端开关(如便携设备电源开/关控制)
  • 反向电池保护与自动切换电路
  • 信号控制与低压直流开关
  • 功率路径切换与电源管理模块(PMIC)中的小功率开关单元
  • 需要小封装、高集成度的消费电子与工业控制板设计

四、封装与热管理

  • SOT-23 封装适合空间受限设计,但其热阻较大,器件的最大耗散功率 1.56 W 需在良好散热与合适的 PCB 铜箔面积下使用。
  • 在连续 2 A 工作或频繁开关的场合,应注意器件结温上升,必要时扩大铜箔散热面积或采用并联、降额工作方式以提高可靠性。

五、使用建议与注意事项

  • 确保栅源电压幅值足以将 P 沟道器件完全导通(建议提供接近规格条件的驱动电压),以达到标称 RDS(on)。
  • 在开关频率较高的应用中,考虑栅极驱动器以减少开关损耗,并在栅极放置合适的阻尼电阻以抑制振铃。
  • 布局时将电源与器件走线最短并加大散热铜箔,滤波与驱动回路尽量靠近器件以减小寄生电感。
  • 注意电气极性:P 型 MOSFET 的栅、源、漏电压极性与 N 型不同,接线错误可能导致永磁导通或损坏。

SI2309 在小体积封装下提供了均衡的电流能力与耐压等级,是电源管理与信号控制场合的实用选择。根据具体的电路工作点与散热条件,选择合适的驱动与版面设计以发挥器件最佳性能。

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