Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
Gigadevice GD32E230F8P6TR
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- Gigadevice GD32E230F8P6TR
- Type
- GIGADEVICE
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- GIGADEVICE
- Electronic Component
- GD32E230F8P6TR
- Electronic Component
- 1
- Package
- TSSOP-20
- Electronic Component
- MCU(MCU / MPU / SOC)
- Electronic Component
- 0.24g
- CPU
- ARM Cortex-M
- I / O
- 15
- Electronic Component
- 1
- ADC
- 12bit
- Electronic Component
- BM0218825839
- Operating Voltage
- 1.8V~3.6V
- CPU
- 72MHz
- Electronic Component
- Electronic Component
- Electronic Component
- 3000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
GD32E230F8P6TR 产品概述
一、产品简介
GD32E230F8P6TR是由北京兆易创新（Gigadevice）推出的一款高性能32位单片机（MCU），其设计目标是满足低功耗应用的需求，并在工业控制、物联网（IoT）、智能家居、医療設備及其他嵌入式系统中广泛应用。该单片机工作电压范围为1.8V至3.6V，适应多种供电场景，尤其适合便携式设备和电池供电的应用。
二、主要特性
处理器核心： GD32E230F8P6TR采用ARM Cortex-M0+核心，主频高达72MHz，具备卓越的处理能力。Cortex-M0+内核具有高效的指令集和极佳的中断响应时间，支持精简的编程和快速的开发周期。
内存配置：
- Flash存储：内置8KB的Flash存储器，使得用户能够存储程序代码和数据，适合中小型应用的需求。
- SRAM存储：配备64KB的SRAM，提供充足的运行时数据存储空间，支持更复杂的计算和数据处理任务。
封装形式： GD32E230F8P6TR采用TSSOP-20封装，体积小巧，适合空间受限的电子产品。其引脚布局合理，确保良好的电气连接和信号完整性。
功耗特点： 该单片机具有极低的静态和动态功耗，特别适合需要长时间运行的电池供电设备。低功耗设计不仅延长了电池寿命，还减少了热量产生，有助于提高系统的可靠性。
三、应用场景
GD32E230F8P6TR适用的应用场景广泛，包括但不限于：
- 物联网设备：智能家居、环境监测、物流追踪等应用中，GD32E230F8P6TR可实现高效的数据采集和处理。
- 工业控制：在自动化和监控系统中，该单片机可用于传感器数据处理和执行控制逻辑。
- 便携式医疗设备：低功耗特性使其非常适合用于无线医疗监测设备，提供实时健康数据更新。
- 消费电子：在各类智能设备中，控制和监测功能的实现，使得产品具有更好的用户体验。
四、技术支持与开发工具
兆易创新为GD32E230F8P6TR提供了丰富的技术支持和开发工具，包括开发板、编程环境和中间件库等。开发者可以基于Keil MDK、IAR Embedded Workbench等主流开发工具进行软件设计，这些工具不仅提供了便利的编程接口，还能加速产品开发周期。
五、总结
GD32E230F8P6TR是一款功能强大且灵活的32位单片机，其组合了高性能、低功耗与丰富的内存配置，非常适合要求严格的嵌入式应用。无论是在单片机的控制逻辑，还是在对复杂运算的实时处理，GD32E230F8P6TR都能满足用户的需求，助力创新产品的开发。随着物联网和智能电子产品的迅速发展，该单片机将为广大电子产品开发者提供更多可能性。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
