WMSIC Electronic Components

Nationstar NH-B1010RGBT-HF

ModelNH-B1010RGBT-HF
PackageSMD-4P,1x1mm
BrandPhotoelectric
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Photoelectric NH-B1010RGBT-HF
Type
SMD-4P, 1X1MM
Minimum package
41000 圆盘

Technical parameters

Power
B:32mW;R:24mW;G:32mW
Electronic Component
Electronic Component
Electronic Component
Photoelectric
Electronic Component
NH-B1010RGBT-HF
Electronic Component
1
Electronic Component
1mm
Package
SMD-4P,1x1mm
Electronic Component
R:620nm;G:530nm;B:470nm
Electronic Component
RGB LED
Electronic Component
0.014g
Electronic Component
1mm
Electronic Component
0.85mm
Electronic Component
1
LED
R:18mcd;G:25mcd;B:4.5mcd
LED
120°
Electronic Component
BM0226419629

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

NH-B1010RGBT-HF 产品概述

一、产品简介

NH-B1010RGBT-HF 是国星光电出品的高密度贴片全彩发光二极管(LED),封装规格为 SMD-4P,外形尺寸为 1.0 × 1.0 × 0.85 mm(1010/0402 型)。该器件采用共阳极(共阳)配置,集成红、绿、蓝三色芯片,适用于微型显示、指示灯及高密度背光等对体积和色彩控制要求严格的应用场景。

二、主要特性

  • 共阳极(共阳)设计,便于单端驱动与色彩混合控制。
  • 三色波长:R 620 nm / G 530 nm / B 470 nm,色域表现良好且显色稳定。
  • 发光角度:120°,光分布均匀,适合面光源与指示用途。
  • 工作温度范围:-30 ℃ 至 +85 ℃,适应常见工业与消费类环境。
  • 小型封装,适合高密度 PCB 布局与自动贴装流程(正贴)。

三、电气与光学参数

  • 正向电压 Vf:R 2.0 V;G 2.6 V;B 2.7 V。
  • 额定正向电流 If:R 5 mA;G 2 mA;B 2 mA(典型工作电流)。
  • 发光强度(典型):R 18 mcd;G 25 mcd;B 4.5 mcd。
  • 功率(典型):R 24 mW;G 32 mW;B 32 mW。
  • 封装引脚:SMD-4P(1x1 mm),共阳结构内置阳极引脚。

注:实际应用中需依据目标亮度、功耗与热管理条件进行驱动电流的选择与热设计,避免长期超过推荐电流。

四、封装与机械尺寸

  • 尺寸:长度 1.0 mm,宽度 1.0 mm,高度 0.85 mm。
  • 封装形式:SMD-4P,适配自动贴装、回流焊工艺。
  • 引脚排列与焊盘设计请参考国星光电提供的封装尺寸图,以确保焊接可靠性与光学一致性。

五、典型应用

  • 微型指示灯、状态指示与按键背光。
  • 可穿戴设备、小型手持终端显示与图标照明。
  • 仪器面板、装饰性背光与短距离信号提示。
  • 需要高密度封装的矩阵显示与灯条应用。

六、设计与使用建议

  • 共阳极接法:将共阳极引脚连接至正电源(Vcc),通过限流电阻或恒流驱动器分别下拉各色阴极以实现发光控制。
  • 串联限流电阻计算示例(以 Vcc = 5 V 为例):Rred = (5.0 − 2.0) / 5 mA ≈ 600 Ω;Rgreen = (5.0 − 2.6) / 2 mA ≈ 1.2 kΩ;Rblue = (5.0 − 2.7) / 2 mA ≈ 1.15 kΩ。
  • 驱动方式:为保证色彩一致性与亮度线性,建议采用恒流驱动或 PWM 调光并配合合适的驱动频率以避免可见闪烁。
  • 热管理:尽量保证良好的 PCB 散热路径,避免长时间在高电流下工作导致器件温升过高而影响寿命与亮度。
  • 焊接注意:遵循通用回流焊曲线并避免反复加热,防止封装损伤与光学性能衰减。建议在生产前参照厂方的焊接与回流规范。

七、可靠性与环境

  • 工作温度:-30 ℃ 至 +85 ℃,适合多数室内与轻工业环境。
  • 产品不含卤素并符合 RoHS 要求(HF 标识表明无卤化学材料),适用于绿色环保设计。
  • 出货建议进行来料可靠性测试(如热循环、湿热、振动与寿命测试)以验证在目标应用工况下的长期稳定性。

总结:NH-B1010RGBT-HF 以其微小体积、共阳易驱动设计与稳定的光学参数,适合高密度、多色控制场景。合理的驱动电路与热设计能有效发挥其色彩表现与使用寿命。若需详细封装图、焊接曲线或样品测试数据,建议联系国星光电获取完整技术资料。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.