WMSIC Electronic Components

Nationstar NH-Z1921RGBA-SG

ModelNH-Z1921RGBA-SG
PackageSMD,2.1x2.1mm
BrandPhotoelectric
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Photoelectric NH-Z1921RGBA-SG
Type
Nationstar
Minimum package
10500 未知

Technical parameters

Power
G:90mW;R:60mW;B:90mW
Electronic Component
Electronic Component
Electronic Component
Photoelectric
Electronic Component
NH-Z1921RGBA-SG
Electronic Component
1
Electronic Component
2.05mm
Package
SMD,2.1x2.1mm
Electronic Component
G:530nm;B:472nm;R:622nm
Electronic Component
RGB LED
Electronic Component
0.05g
Electronic Component
2.15mm
Electronic Component
1.9mm
Electronic Component
1
LED
R:390mcd;G:680mcd;B:95mcd
LED
110°
Electronic Component
BM0228289520

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

NH-Z1921RGBA-SG 产品概述

一、产品简介

NH-Z1921RGBA-SG 是国星光电推出的一款高性价比 SMD RGB 发光二极管,封装尺寸约 2.1×2.1mm(1921),采用共阳极(Common Anode)配置。三基色中心波长分别为红 622nm、绿 530nm、蓝 472nm,发光角度宽达 110°,适合小型面光源、指示与显示应用以及精细色彩混合场合。

二、主要技术参数

  • 封装:SMD,尺寸 2.1×2.1mm(宽 2.05mm、长 2.15mm、高 1.9mm)
  • 配置:共阳极(One common anode)
  • 波长:R 622nm、G 530nm、B 472nm
  • 发光角度:110°
  • 额定正向电流(典型):R 15mA、G 8mA、B 5mA
  • 正向压降(Vf):R 2.1V、G 2.9V、B 2.9V
  • 发光强度(典型,额定电流下):R 390 mcd、G 680 mcd、B 95 mcd
  • 功率(典型):R 60 mW、G 90 mW、B 90 mW
  • 工作温度:-30 ℃ ~ +85 ℃
  • 安装方式:正贴(SMD)

三、电气与驱动建议

  • 驱动方式:共阳极结构下,阳极接正电源,分别通过低侧开关(NMOS、NPN 或 开漏驱动器)控制 R/G/B 三路。建议使用恒流驱动或在每通道串接合适限流电阻。
  • 限流电阻计算示例(以 VCC = 5V 为例):
    • R 通道:R = (5V − 2.1V) / 15mA ≈ 200Ω
    • G 通道:R = (5V − 2.9V) / 8mA ≈ 270Ω
    • B 通道:R = (5V − 2.9V) / 5mA ≈ 430Ω
  • 调光建议:采用 PWM 调光控制色彩与亮度,PWM 频率建议 ≥ 1kHz 以避免可见闪烁;使用 8 位或更高分辨率可获得更平滑的色彩过渡。
  • 功率与热管理:尽量避免在高温条件下长期满额定电流工作;必要时降低电流或安排散热措施以延长寿命并稳定色坐标。

四、封装与安装建议

  • PCB 封装:建议按厂商推荐脚位与焊盘布局设计,保留适当的焊盘尺寸和助焊膏印刷量以保证焊点可靠性。
  • 回流焊:建议按照无铅回流工艺进行焊接,遵循 IPC/JEDEC 回流温度曲线(峰值建议不超过 260°C)。
  • 防护及搬运:注意防静电(ESD)保护,存储期间避免受潮或长时间暴露在高温高湿环境,必要时按标准进行回流前烘烤。

五、典型应用与注意事项

  • 典型应用:消费类指示灯、移动设备指示/背光、状态指示面板、RGB 点阵、装饰照明与小型显示模块。
  • 注意事项:在设计时应根据最终显示需求合理配比 R/G/B 驱动电流以获得目标色域与亮度;若要求严格色彩一致性,应进行批次选择或配色校准。对高可靠性场合,建议做热与寿命验证(包括高温老化、循环应力测试)。

NH-Z1921RGBA-SG 以其微小封装、宽视角及良好的色彩表现,适合对体积与色彩控制有较高要求的消费与工业类产品。在设计导入前,建议参考国星光电提供的详细数据手册及封装图纸以完成电气与机械匹配。

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