WMSIC Electronic Components

Nationstar NCD0603B4

ModelNCD0603B4
Package0603
BrandPhotoelectric
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Photoelectric NCD0603B4
Type
Nationstar
Minimum package
4000 圆盘

Technical parameters

Power
72mW
Electronic Component
Electronic Component
Electronic Component
Photoelectric
Electronic Component
NCD0603B4
Electronic Component
1
Package
0603
Electronic Component
466nm~478nm
Electronic Component
LEDDiode / LED
Electronic Component
0.023g
Electronic Component
1
LED
65mcd
LED
130°
LED
Electronic Component
Electronic Component
BM0226420365
Electronic Component
465nm
Operating Temperature
30℃~+85℃

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

NCD0603B4 产品概述

一、产品简介

NCD0603B4 是国星光电(NationStar)推出的一款0603 封装蓝光贴片发光二极管。器件在20 mA 驱动电流下提供稳定的蓝色发光,峰值波长约465 nm,常见发光波段为466–478 nm。小体积、高亮度与宽视角相结合,适合对空间和封装密度有较高要求的电子终端指示与背光应用。

二、主要性能参数

  • 发光颜色:蓝色
  • 峰值波长:约 465 nm;波长范围:466–478 nm
  • 正向电流(If):20 mA(典型工作电流)
  • 正向压降(Vf):2.6 V ~ 3.6 V(在规定电流下)
  • 发光强度:65 mcd(在标称条件下)
  • 功率:约 72 mW(If × Vf 最大值下)
  • 发光角度:130°(宽视角设计)
  • 工作温度:-30 ℃ ~ +85 ℃
  • 封装:0603 SMD,品牌:国星光电

三、封装与机械特性

0603 封装尺寸小,便于高密度贴装与微型化产品设计。该封装对焊盘设计与回流焊工艺要求较高,推荐参考国星光电的PCB焊盘与回流温度曲线以保证焊点质量与器件可靠性。0603 LED 适合自动贴装,适配常见贴片机与回流生产流程。

四、热、电与可靠性建议

在20 mA 驱动下器件耗散功率最高可达约72 mW,应注意整体热管理与散热路径设计,避免长期在高温下满载工作导致光衰。建议在高温环境下进行电流降额以延长寿命。器件对静电敏感,生产与测试过程需做好ESD 防护。采用恒流驱动或合适的限流电阻可保证稳定发光并防止过流损坏。

五、典型应用场景

  • 面板与仪表指示灯、状态指示(消费电子、工控设备)
  • 键盘、按键背光与功能指示
  • 可穿戴设备与便携式终端的小面积背光
  • IoT 设备、指示灯阵列与信号提示场合

六、选型与使用建议

  • 驱动方式:建议使用恒流源或在串联限流电阻的恒压源下工作;PWM 调光可实现亮度控制,注意PWM 频率避免可见闪烁。
  • PCB 布局:尽量提供畅通的散热路径,焊盘尺寸参照国星光电推荐封装图纸。
  • 回流焊:按厂方推荐的回流曲线进行,避免超温和过长的高温停留。
  • 存储与搬运:避免潮湿及静电,必要时进行烘烤去湿处理后再回流焊。

本产品由国星光电生产,适用于对微型化与可靠性要求较高的蓝光指示与背光场合。选型与最终电路设计建议参考厂方详细规格书与可靠性数据。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.