WMSIC Electronic Components

Nationstar NH-Z3535RGBA-SG

ModelNH-Z3535RGBA-SG
PackageSMD3535
BrandPhotoelectric
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Photoelectric NH-Z3535RGBA-SG
Type
Nationstar
Minimum package
9000 卷

Technical parameters

Power
R:62mW;G:90mW;B:90mW
Electronic Component
Photoelectric
Electronic Component
NH-Z3535RGBA-SG
Electronic Component
1
Electronic Component
3.5mm
Package
SMD3535
Electronic Component
G:520nm;B:470nm;R:622nm
Electronic Component
RGB LED
Electronic Component
0.178g
Electronic Component
3.7mm
Electronic Component
2.8mm
Electronic Component
1
LED
G:1330mcd;R:650mcd;B:280mcd
LED
110°
Electronic Component
BM0226994863
Operating Temperature
30℃~+85℃

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

NH-Z3535RGBA-SG 产品概述

一、产品简介

NH-Z3535RGBA-SG 是国星光电推出的一款高亮度 SMD 3535 系列发光二极管,适用于背光、指示灯、信号显示及彩色照明等应用。器件体积小(3.5×3.7×2.8 mm),视角宽(110°),采用正贴(贴片)载带方式,便于自动贴装与批量生产。

二、主要电气与光学参数

  • 正向电流(If):R/G/B 均为 20 mA(典型工作驱动电流)。
  • 正向压降(Vf):R = 2.2 V;G = 3.2 V;B = 3.3 V。
  • 功率(Pd):R = 62 mW;G = 90 mW;B = 90 mW。
  • 峰值波长(典型):R = 622 nm;G = 520 nm;B = 470 nm。
  • 发光强度(Iv):G = 1330 mcd;R = 650 mcd;B = 280 mcd(在 20 mA 时典型值)。
  • 发光角度:110°(中心光束宽,利于匀光设计)。
  • 工作温度:-30 ℃ 至 +85 ℃。

三、封装与尺寸

  • 封装类型:SMD3535(表面贴装,适配 SMT 设备)。
  • 外形尺寸:宽度 3.5 mm,长度 3.7 mm,高度 2.8 mm。
  • 载带方式:正贴(Tape & Reel),利于自动化贴装与回流焊工艺。
  • 品牌:国星光电(NationStar)。

四、优势与特性

  • 高可靠性:国星光电成熟制造工艺与严格测试流程,适合商用与工业级长期使用。
  • 宽视角与均匀光场:110° 发光角度便于实现柔和、均匀的照明效果,降低暗斑。
  • 低功耗高亮度:在 20 mA 驱动下具有良好的光效比,适合显示与指示应用。
  • 兼容自动化生产:SMD3535 封装和载带包装支持高速贴片与回流焊。

五、应用场景

  • 背光模组(显示器、按键背光)。
  • 指示灯与信号灯(面板、仪表)。
  • 色彩照明与装饰灯(需 RGB 调光)。
  • 传感器或智能设备屏显及状态指示。

六、设计与使用建议

  • 驱动设计:建议采用恒流驱动源,标准工作电流 20 mA,可根据散热与亮度需求适当降流以延长寿命或提升可靠性。
  • 散热管理:尽管单颗功率较小,仍应关注 PCB 散热路径(增加铜箔面积或散热层),避免长时间高温工作。
  • 焊接工艺:推荐按回流焊温度曲线进行,无铅回流时控制预热与峰值温度,避免过热导致光衰或封装变形。
  • 抗静电与防潮处理:在 SMT 过程中注意 ESD 防护与干燥存储,防止水汽吸附导致焊接缺陷。

七、可靠性与测试

NH-Z3535RGBA-SG 经温循环、湿热、振动与寿命测试,适配-30 ℃ 至 +85 ℃ 环境。建议在最终产品验证阶段进行加速寿命测试(高温高湿、持续高电流)以确认应用场景下的寿命与光衰表现。

八、采购与支持

如需样品或批量采购,请在选型时确认正向电流、配套驱动方案及封装方向(正贴),并向供应商索取完整数据手册、LM-79/LM-80 等测试报告以支持光学与热设计验证。

如需进一步的电路参考、散热建议或配光曲线与光色坐标数据,可提供具体设计要求后给出针对性建议。

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