WMSIC Electronic Components

Nationstar FM-Z2727RGBA-SH

ModelFM-Z2727RGBA-SH
PackageSMD,2.7x2.8mm
BrandPhotoelectric
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Photoelectric FM-Z2727RGBA-SH
Type
Nationstar
Minimum package
8000 卷

Technical parameters

Power
B:85mW;R:62.5mW;G:85mW
Electronic Component
Photoelectric
Electronic Component
FM-Z2727RGBA-SH
Electronic Component
1
Electronic Component
2.7mm
Package
SMD,2.7x2.8mm
Electronic Component
B:474nm;G:525nm;R:622nm
Electronic Component
RGB LED
Electronic Component
0.075g
Electronic Component
2.8mm
Electronic Component
2.45mm
Electronic Component
1
LED
B:120mcd;G:750mcd;R:470mcd
LED
110°
Electronic Component
BM0227604277
Operating Temperature
30℃~+85℃

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

FM-Z2727RGBA-SH 产品概述

一、产品简介

FM-Z2727RGBA-SH 为国星光电推出的一款高可靠性四色独立发光二极管(RGBA)SMD 封装产品。封装尺寸为 2.7×2.8mm,四颗二极管独立控制,适用于精细显示、背光与装饰照明等对色彩与体积有严格要求的应用场景。工作温度范围宽,适应性强,便于贴片自动化生产。

二、主要参数

  • 波长:B 474nm / G 525nm / R 622nm
  • 发光角度:110°(漫射型)
  • 正向电流(典型):B 5mA / G 8mA / R 15mA
  • 正向压降Vf(典型):B 2.7V / G 2.7V / R 2.1V
  • 发光强度(典型):B 120mcd / G 750mcd / R 470mcd
  • 功率(典型):B 85mW / G 85mW / R 62.5mW
  • 工作温度:-30℃ ~ +85℃
  • 封装:SMD 正贴,尺寸 W×L×H = 2.7×2.8×2.45mm
  • 配置:独立二极管,四色可分别驱动

三、特性与优势

  • 小体积、高亮度:适合窄间距、紧凑型光源设计。
  • 宽视角 110°:光分布均匀,便于视觉混色与背光扩散。
  • 独立驱动:RGBA 可按需混色,实现丰富色彩控制与精准校色。
  • 宽工作温度:适用于室内外多种环境,可靠性高。
  • 兼容 SMT 贴装流程:便于自动化生产与批量制造。

四、典型应用

  • 小型显示模块、指示灯与图形界面光源
  • RGB 背光、舞台装饰与灯光效果装置
  • 智能家居与物联网设备的状态指示与色彩化提示
  • 可穿戴设备与微型照明系统

五、使用建议与注意事项

  • 驱动方式:建议使用恒流驱动,按颜色分别设置限流;亮度调节可采用 PWM 控制,频率应高于人眼可感知范围以避免闪烁。
  • 散热与热老化:高电流长时间工作会提升结温,需考虑 PCB 散热与环境温度对亮度的衰减,必要时做电流降额。
  • 焊接要求:推荐参照国星光电回流焊曲线,峰值温度不超过 260℃,避免重复高温循环。
  • ESD 与静电保护:器件对静电敏感,装配与测试时应采取防静电措施(接地手环、离子风等)。
  • 存储与保管:避免潮湿与阳光直射,开封后按厂方建议在规定时间内回流焊接以防吸湿胀裂。
  • 资料与封装图:具体引脚定义、焊盘推荐尺寸及光学方向请参考国星光电官方数据手册与封装图纸。

本概述以典型参数为准,设计与关键可靠性评估时建议参考原厂完整规格书与测试报告。

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