Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
Nationstar NFD3401PT
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
16
specifications
Core information
- Product name
- Photoelectric NFD3401PT
- Type
- Nationstar
- Minimum package
- 1000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- Photoelectric
- Electronic Component
- NFD3401PT
- Electronic Component
- 1
- Package
- Through-hole, D=3mm
- Electronic Component
- Receiver (IRM)
- Electronic Component
- 0.168g
- Electronic Component
- 1
- Electronic Component
- BM0258756458
- Operating Temperature
- 25℃~+85℃
- Power Dissipation(Pd)
- 75mW
- Electronic Component
- Electronic Component
- Electronic Component
- 1000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
NFD3401PT 产品概述
一、产品简介
NFD3401PT 为国星光电（NationStar）系列插件式发光元件，封装直径为 3mm（D=3mm），适用于需要可靠指示和小型光源的各类电子设备。器件设计用于在宽广的环境温度下稳定工作，标称工作温度范围为 -25℃ 至 +85℃。其结构为传统插件（穿孔）封装，便于手工装配和波峰/选择性波峰焊接工艺。
二、主要特性
- 插件 3mm 小型封装，体积小、外形经典，便于面板指示与机电一体化产品安装；
- 适用温度范围 -25℃～+85℃，满足一般民用与工业电子环境要求；
- 能耗低、响应快、寿命长（相较于传统白炽指示灯寿命和能效都有明显优势）；
- 机械强度好，抗振动性能适合多数普通工业应用；
- 可与常见限流电阻、驱动电路直接配合使用，便于电路设计与维护。
三、典型应用
- 面板与机柜状态指示灯；
- 家用电器指示与背光（例如控制面板小指示灯）；
- 仪表仪器、测控设备、安防设备的状态显示；
- 教育与实验用电子模块、DIY 电子项目；
- 小型信号与指示灯具场合（验收时建议按光色与亮度做样品确认）。
四、封装与安装建议
NFD3401PT 为直插式（THT）封装，外观为圆头或半透镜型（具体外观与光学参数请以厂家数据手册为准）。常见安装注意事项包括：
- PCB 钻孔尺寸应与器件引脚及固定要求匹配，保证机械安装稳固；
- 插件元件可采用波峰焊或手工焊接，焊接时避免长时间高温作用于本体；
- 装配后建议进行视觉与电气检测，确认焊接可靠且无短路或虚焊。
五、可靠性与环境适应
器件设计考虑了常见工业及民用工作环境，工作温度 -25℃～+85℃ 提供了基本的热稳定性。使用时应注意：
- 超出额定温度可能影响发光效率与寿命；
- 建议防潮、防尘保存，长期存放时遵循出厂包装与存储说明；
- 安装与维护过程中注意静电防护与机械冲击，避免损伤器件。
六、选型与使用要点
- 在选型时需确认所需光色、亮度等级（bin）、视角及光谱等参数，因不同批次/品种会有光学性能差异；
- 驱动电流与限流电阻应按实际应用需求设计，常见小型 LED 的典型工作电流区间为数毫安至数十毫安，详细额定电流请参照数据手册；
- 若用于要求更严苛的工业或户外环境，应评估额定温度、封装防护与认证等级是否满足要求；
- 如需批量使用，建议索取样品进行实际功率、亮度与老化测试，以保证一致性。
七、结语与建议
NFD3401PT 作为国星光电的 3mm 插件光电元件，以其小巧的封装与成熟的工艺适用于多种指示与显示场景。为确保设计与可靠性满足项目要求，建议在最终选型前参考完整数据手册，按典型应用进行样品验证，并与供应商确认光学与电气的分bin、交期及封装供货信息。若需进一步的电路匹配或装配工艺建议，可根据具体使用环境提供更详尽的技术支持。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
1 Piece BGA Integrated Circuit Chipset MN864739 CXD90061GG CXD90062GG PS5 QFN-80
- Model
- MN864739
- Package
