WMSIC Electronic Components

Nationstar NTD3528I3

ModelNTD3528I3
Package3528
BrandPhotoelectric
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Photoelectric NTD3528I3
Type
Nationstar
Minimum package
2000 卷

Technical parameters

Electronic Component
Photoelectric
Electronic Component
NTD3528I3
Electronic Component
1
Package
3528
Electronic Component
845nm~860nm
Electronic Component
Infrared Emitter
Electronic Component
60°
Electronic Component
0.057g
Electronic Component
40nm
Electronic Component
1
Electronic Component
BM0228550477
Operating Temperature
40℃~+85℃
Current
100mA
Electronic Component
35mW/sr
(Vf)
1.4V~1.6V
Power Dissipation(Pd)
80mW

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

NTD3528I3 产品概述

NTD3528I3 是国星光电推出的一款 3528 封装近红外发光二极管,针对夜视照明、红外遥控、光电传感等应用优化设计。该器件在 845nm~860nm 波段具有稳定的辐照性能,配合小体积 SMD 封装,便于高速贴装与系统集成。

一、主要参数与特点

  • 波长(峰值):845nm ~ 860nm(近红外)
  • 正向压降 Vf:1.4V ~ 1.6V(典型工作点)
  • 正向电流 If:100mA(最大额定电流)
  • 耗散功率 Pd:80mW(单颗芯片最大耗散,使用时需注意热管理)
  • 辐射强度:35mW/sr(方向性强,适合定向照明)
  • 视角:60°
  • 半波宽(FWHM):40nm
  • 直流反向耐压 Vr:10V
  • 工作温度范围:-40℃ ~ +85℃
  • 封装:3528 SMD,适合贴片工艺

二、性能优势

NTD3528I3 在近红外带内能提供高辐照强度和较窄的发射带宽,配合 60° 的视角能实现良好的照明聚焦效果。3528 小尺寸封装利于密集排布与光学配列,同时便于与光学透镜或光导结合,提高系统效率。

三、应用场景

适用于安防夜视补光、红外照明模组、图像传感器增强、近距离测距与手势识别、红外遥控以及部分工业光电检测系统。其不可见光谱使得在不影响可见观察的情况下提供有效照明或信号发射。

四、使用与热管理建议

鉴于 Pd=80mW 与 If=100mA 的配合关系,建议:

  • 优先采用恒流驱动,避免超过规格峰值电流;
  • 如需高电流脉冲驱动,应控制占空比并保证间歇冷却;
  • 在 PCB 设计中增加过孔连接底座铜箔,并使用热沉或散热层以降低结温;
  • 工作温度超限会显著降低寿命与输出,系统设计应确保结温在允许范围内。

五、可靠性与封装注意事项

3528 封装兼顾自动化贴装与热稳定性,焊接建议参考国星提供的回流曲线。储存时注意防潮防静电,若出厂为防潮封装,开封后按 MS(或供应商建议)等级进行回流前干燥处理以避免焊接缺陷与光衰。

六、选型与替代

在选择器件时,应根据系统光学设计(发光角、强度、波长容差)与电热预算评估实际工作点。若需更高功率或更窄光谱,可考虑同厂或同类产品系列的中高功率封装替代。

如需详细电气/光学曲线、封装尺寸图或回流焊资料,可联系供应商获取器件数据手册以便完成系统级设计验证。

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