WMSIC Electronic Components

Nationstar NCD1803W1

ModelNCD1803W1
PackageSMD,1.8x0.3mm
BrandPhotoelectric
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Photoelectric NCD1803W1
Type
Nationstar
Minimum package
4000 未知

Technical parameters

Power
75mW
Electronic Component
Electronic Component
Electronic Component
Photoelectric
Electronic Component
NCD1803W1
Electronic Component
1
Package
SMD,1.8x0.3mm
Electronic Component
LEDDiode / LED
Electronic Component
0.023g
Electronic Component
1
LED
90mcd
LED
145°
LED
Electronic Component
Electronic Component
BM0229463331
Operating Temperature
40℃~+85℃
Current
25mA
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

NCD1803W1 产品概述

一、产品简介

NCD1803W1 是国星光电推出的一款高可靠性白光表面贴装发光二极管(LED),单颗独立二极管封装,尺寸为超薄 SMD 1.8 × 0.3 mm。该器件以较低的正向电压和适中的光强、宽视角为特点,适用于各种空间受限且需均匀可视指示的场合,如按键指示、仪表面板、可穿戴设备和移动终端等。

二、主要电气与光学参数

  • 发光颜色:白色
  • 正向压降(Vf):2.5 V ~ 3.0 V(典型值随批次、档位有所变化,请以出厂光电数据表为准)
  • 额定工作电流(If):25 mA(单颗)
  • 功率耗散:75 mW(最大)
  • 发光强度:90 mcd(在标称驱动电流下)
  • 发光角度:145°(宽角,便于均匀照明/指示)
  • 二极管配置:独立二极管(单管单芯片)

这些参数决定了 NCD1803W1 在常规微弱至中等亮度指示应用中的表现,正向压降和功率消耗使其在 3V 左右的供电系统中有良好匹配性。

三、封装与机械特性

  • 封装形式:SMD(表面贴装)
  • 外形尺寸:1.8 mm × 0.3 mm,超薄扁平设计,适合高度受限的产品布局
  • 载带方式:正贴(标准卷带,适配主流贴片机)

超薄封装利于减小组件厚度、提升装配密度;145° 的发光角度有利于减少指示盲区,提升可视性。

四、驱动与热管理建议

  • 典型驱动方式:恒流驱动或串联限流电阻。对于单颗独立 LED,常见做法是使用恒流源或在单电源下串接限流电阻控制 If。
  • 电阻选择示例(以 5 V 供电为例):当假设 Vf = 2.8 V、目标 If = 20 mA 时,R = (5.0 − 2.8) / 0.02 ≈ 110 Ω;若驱动 If = 25 mA,则 R ≈ 88 Ω。
  • 功率校验:LED 自身耗散 P_LED ≈ Vf × If(例如 Vf=2.8 V、If=25 mA 时 P≈70 mW,低于 75 mW 限值)。限流电阻的功耗 P_R = (Vs − Vf) × If,应确保电阻额定功率足够。
  • 热管理:尽管单颗功耗不高,但封装小、热阻较大,推荐在 PCB 设计中为 LED 附近保留合适铜箔散热并避免密集热源堆积;在高温工作环境下应进行电流降额以保证寿命和亮度稳定性。
  • 回流焊建议:遵循 J-STD-020 常规回流曲线,避免过高峰值温度和过长高温保持时间。贴装和回流工艺必须与 PCB 工艺相匹配。

五、可靠性与环境适应性

  • 工作温度范围:−40 ℃ ~ +85 ℃,覆盖工业级常见温度区间,适合大多数室内与室外电子应用。
  • 使用建议:建议在潮湿敏感元件管理(MSL)规范下进行存储与贴装,贴装前对卷带进行回潮处理(若厂家数据表有相应要求)。同时注意 ESD 防护,避免静电损伤 LED 芯片。

六、应用场景与选型建议

适用场景包括但不限于:

  • 指示灯、按键背光、面板状态指示
  • 可穿戴设备与移动终端的小型提示灯
  • 工业控制面板与医疗设备的低功耗指示
  • 需要宽视角和均匀可见性的装置(145° 宽角优势)

选型时重点考虑:系统供电电压、可用PCB空间、工作温度范围、预期亮度与寿命要求。若需更高亮度或色温控制,请参考国星光电提供的分档(bin)数据,或选用同系列其他型号。

七、注意事项与包装信息

  • 型号与品牌:NCD1803W1,国星光电出品;出货通常以卷带(正贴载带)方式供货,适配 SMT 自动化装配。
  • 质量验证:在设计验证阶段建议进行实际样件测试,包括温升、光通量/光强随电流和温度的变化、焊接可靠性等。
  • 安全与合规:在关键应用(如医疗、汽车)中选型时,请向供应商获取完整的可靠性和认证资料。

如需进一步的电气特性曲线、光强随电流/温度的曲线、典型光谱或封装尺寸图(PCB pad 推荐尺寸、回流曲线),可向国星光电或代理渠道索取完整的数据手册以做最终设计定稿。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.