WMSIC Electronic Components

GR GR7889

ModelGR7889
PackageSOP-8
BrandGR
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
GR GR7889
Type
SOP-8
Minimum package
4000 编带

Technical parameters

Electronic Component
Electronic Component
Electronic Component
GR
Electronic Component
GR7889
Electronic Component
1
Package
SOP-8
Electronic Component
Brushed DC Motor Driver IC
Electronic Component
0.07g
Electronic Component
1
Integrated FET
Electronic Component
Features
Motor
Electronic Component
BM0263546181
Current
10A
Operating Temperature
20℃~+85℃
Operating Voltage
2V~20V
Output Current
3.3A
Static Current(Iq)
10nA

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

GR7889集成FET电源管理器件产品概述

GR7889是国睿(GR)品牌推出的一款高集成度、低功耗电源管理IC,专为电池供电及低待机功耗场景优化设计,集成功率MOSFET简化外围电路,具备宽电压输入、高效输出及超低静态功耗等核心优势,广泛适用于消费类电子、物联网终端及小型工业控制等领域。

一、产品核心定位与应用场景

GR7889定位于高集成度低功耗电源转换器件,核心解决传统电源设计中外接功率MOSFET带来的BOM成本高、PCB面积大、设计复杂度高等问题,同时针对电池供电设备的待机功耗痛点,实现极低静态电流下的高效输出。

其典型应用场景包括:

  • 便携式电子设备:手持终端、移动电源、户外应急电源等;
  • 物联网终端节点:低功耗传感器、智能门锁、环境监测节点等;
  • 小型工业控制系统:PLC辅助电源、电机驱动模块、工业传感器供电等;
  • 消费类智能家居:智能插座、温湿度传感器、小型家电控制单元等。

二、关键性能参数详解

GR7889的核心参数针对低功耗与高效输出做了针对性优化,关键指标如下:

1. 宽电压输入范围(2V~20V)

覆盖常见电源输入场景:

  • 单节锂离子电池(3.7V典型值,2.5V~4.2V范围);
  • 多节干电池(2节10节AA/AAA电池,3V15V范围);
  • 低压直流电源(5V、9V、12V等常规适配器输出); 无需额外电压转换电路即可适配多种输入源,提升设计灵活性。

2. 高效输出能力(3.3A连续/10A峰值)

  • 连续输出电流3.3A:满足常规负载(如小型电机、MCU+外设)的稳定供电需求;
  • 峰值电流10A:支持瞬时大电流负载(如电容充电、电机启动瞬间),避免因峰值电流不足导致的设备重启或损坏,无需额外配置大电流电容。

3. 超低静态功耗(10nA)

静态电流仅10nA(典型值),远低于常规电源IC的μA级静态电流,电池供电时待机功耗可忽略不计:以1000mAh锂电池为例,仅静态电流的待机时间可达约11.4年(理论值),大幅延长设备续航能力,尤其适合长期待机的物联网节点。

4. 宽工作温区(-20℃~+85℃)

满足常规工业级与消费类环境需求:

  • 低温场景:户外设备冬季低温(-20℃)下仍能稳定工作;
  • 高温场景:设备内部散热导致的环境温度升高(+85℃)下无性能衰减,可靠性有保障。

三、集成化设计优势

GR7889集成功率MOSFET是其核心设计亮点,相比传统外接MOSFET的方案,具备以下优势:

1. 简化外围电路

无需额外采购功率MOS管、驱动电阻等元件,仅需少量电容、电感即可完成电源设计,BOM成本降低约15%~20%(以常规3.3A输出方案对比)。

2. 缩小PCB面积

SOP-8封装本身尺寸紧凑(约5mm×6mm),加上集成FET减少的外围元件占用,PCB面积可缩小30%以上,适合小型化设备(如可穿戴设备、小型传感器)的空间限制。

3. 提升可靠性

减少外接元件数量意味着减少焊接点与故障点,降低因MOS管损坏、驱动电路失效导致的设备故障概率,适合对可靠性要求较高的工业场景。

4. 降低设计门槛

集成FET避免了功率MOS管的选型、驱动电路设计(如栅极电阻匹配)等复杂环节,普通工程师即可快速完成电路设计,缩短产品开发周期。

四、封装与可靠性验证

GR7889采用SOP-8贴片封装,符合行业标准封装尺寸,适配自动化贴装生产线,生产效率高。封装引脚布局优化了散热路径,确保3.3A连续输出时的热稳定性,无需额外散热片即可满足常规环境下的散热需求。

此外,产品经过多轮可靠性测试:

  • 高低温循环测试(-40℃~+125℃,1000次循环);
  • 湿度老化测试(85℃/85%RH,1000小时);
  • 静电放电(ESD)测试(±8kV接触放电,±15kV空气放电); 确保在复杂环境下的长期稳定工作。

五、总结

GR7889集成FET电源管理器件凭借宽电压范围、高效输出、超低静态功耗、高集成度等核心优势,为电池供电设备、物联网终端及小型工业控制领域提供了高性价比的电源解决方案。其简化的设计流程、紧凑的封装及可靠的性能,可有效降低产品开发成本与周期,提升设备续航与稳定性,是此类场景下的优选电源IC。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.