Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
Available for RFQ
Technical data
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
GR7889是国睿(GR)品牌推出的一款高集成度、低功耗电源管理IC,专为电池供电及低待机功耗场景优化设计,集成功率MOSFET简化外围电路,具备宽电压输入、高效输出及超低静态功耗等核心优势,广泛适用于消费类电子、物联网终端及小型工业控制等领域。
GR7889定位于高集成度低功耗电源转换器件,核心解决传统电源设计中外接功率MOSFET带来的BOM成本高、PCB面积大、设计复杂度高等问题,同时针对电池供电设备的待机功耗痛点,实现极低静态电流下的高效输出。
其典型应用场景包括:
GR7889的核心参数针对低功耗与高效输出做了针对性优化,关键指标如下:
覆盖常见电源输入场景:
静态电流仅10nA(典型值),远低于常规电源IC的μA级静态电流,电池供电时待机功耗可忽略不计:以1000mAh锂电池为例,仅静态电流的待机时间可达约11.4年(理论值),大幅延长设备续航能力,尤其适合长期待机的物联网节点。
满足常规工业级与消费类环境需求:
GR7889集成功率MOSFET是其核心设计亮点,相比传统外接MOSFET的方案,具备以下优势:
无需额外采购功率MOS管、驱动电阻等元件,仅需少量电容、电感即可完成电源设计,BOM成本降低约15%~20%(以常规3.3A输出方案对比)。
SOP-8封装本身尺寸紧凑(约5mm×6mm),加上集成FET减少的外围元件占用,PCB面积可缩小30%以上,适合小型化设备(如可穿戴设备、小型传感器)的空间限制。
减少外接元件数量意味着减少焊接点与故障点,降低因MOS管损坏、驱动电路失效导致的设备故障概率,适合对可靠性要求较高的工业场景。
集成FET避免了功率MOS管的选型、驱动电路设计(如栅极电阻匹配)等复杂环节,普通工程师即可快速完成电路设计,缩短产品开发周期。
GR7889采用SOP-8贴片封装,符合行业标准封装尺寸,适配自动化贴装生产线,生产效率高。封装引脚布局优化了散热路径,确保3.3A连续输出时的热稳定性,无需额外散热片即可满足常规环境下的散热需求。
此外,产品经过多轮可靠性测试:
GR7889集成FET电源管理器件凭借宽电压范围、高效输出、超低静态功耗、高集成度等核心优势,为电池供电设备、物联网终端及小型工业控制领域提供了高性价比的电源解决方案。其简化的设计流程、紧凑的封装及可靠的性能,可有效降低产品开发成本与周期,提升设备续航与稳定性,是此类场景下的优选电源IC。
Request for quote
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products