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HGSEMI SP3485EIM/TR SP3485EIM
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- HGSEMI SP3485EIM / TR
- Type
- HGSEMI
- Minimum package
- 2500
Technical parameters
- Electronic Component
- HGSEMI
- Electronic Component
- SP3485EIM/TR
- Electronic Component
- 1
- Package
- SOP-8
- Type
- Transceiver
- Electronic Component
- RS-485 / RS-422IC
- Electronic Component
- 0.236g
- Electronic Component
- 256
- Electronic Component
- 1
- Features
- Tx / Rx;;;; Low Power
- Electronic Component
- BM0227209807
- Operating Temperature
- 40℃~+85℃
- Operating Voltage
- 3V~3.6V
- Receiver
- 1
- Data
- 12Mbps
- Communication
- Electronic Component
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
SP3485EIM/TR 产品概述
一、产品简介
SP3485EIM/TR 是华冠（HGSEMI）推出的一款工业级半双工差分收发器，采用 SOP-8 封装（带卷带包装 TR 选项），专为 RS-485/RS-422 总线应用设计。器件集成 1 路驱动器与 1 路接收器，工作电压范围为 3.0V 至 3.6V（典型 3.3V 系统兼容），支持高达 12 Mbps 的数据速率，并可在严苛环境（-40℃ 至 +85℃）下稳定工作。
二、主要特性
- 单驱动器/单接收器配置，半双工通讯模式；适用于点对多点总线拓扑。
- 支持高达 12 Mbps 数据速率，满足高速串行链路需求。
- 总线节点数最多可支持 256 节点，适合大规模分布式系统。
- 工作电压 3.0V–3.6V，低压供电设计，便于与 3.3V 嵌入式系统直接接口。
- 工作温度范围 -40℃ 至 +85℃，满足工业等级可靠性要求。
- 静态电流仅 520 μA（静态/待机态），利于低功耗系统设计。
- 强抗扰度：器件对静电/浪涌保护能力高达 15 kV（典型 IEC 61000-4-2 等级），提高系统可靠性。
三、电气与热特性要点
SP3485EIM/TR 以低电压低功耗为设计目标，适合电池供电或严格功耗预算的系统。实际布局时建议靠近供电引脚放置 0.1 μF 陶瓷去耦电容以抑制瞬态干扰，并考虑器件的热耗散与环境温度，保证长期稳定工作。
四、总线保护与可靠性
器件本体具备高达 15 kV 的静电放电抗扰度，显著降低安装和现场调试中的损坏风险。为进一步提升系统鲁棒性，建议在总线入口处增加共模电感或差分 TVS，与 PCB 防护网络配合使用，以应对雷击或感应浪涌。
五、典型应用场景
- 工业自动化与现场总线（PLC、I/O 模块）
- 建筑自动化与楼宇控制（门禁、照明控制）
- 智能电表、抄表与能源管理系统
- 安防监控、门禁与串行外设扩展
- POS、楼宇与交通信号系统的长距离差分通讯
六、封装与订购信息
- 封装：SOP-8（易于自动贴片与生产实现）
- 订购型号：SP3485EIM/TR（TR 表示卷带包装，适合 SMT 生产线）
- 品牌：HGSEMI（华冠）
七、设计与使用建议
- 总线两端建议并联 120 Ω 的差分终端电阻以抑制反射；为保证空闲总线状态确定性，应采用偏置电阻形成故障安全（biasing）网络，具体阻值根据节点数和总线电容调整。
- 半双工模式下需合理控制驱动器使能（DE/RE 等控制信号），避免总线冲突。
- 布线方面优先采用差分对对称走线、减少分叉，尽量避免与高频开关电源或大电流轨并行。
- 长线场合推荐在节点处加入共模抑制器和浪涌保护元件，提升 EMC 与抗扰性。
八、采购与注意事项
在采购时确认工作温度等级、封装与包装（SOP-8、TR）以匹配生产需求；若系统有更高速率或更强短路保护需求，可在方案评估阶段与器件供应商沟通相关测试数据与参考设计。
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