WMSIC Electronic Components

HGSEMI 74HC4051MT/TR 74HC4051MT

Model74HC4051MT/TR
PackageTSSOP-16
BrandHGSEMI
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
HGSEMI 74HC4051MT / TR
Type
HGSEMI
Minimum package
2500 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
HGSEMI
Electronic Component
74HC4051MT/TR
Electronic Component
1
Package
TSSOP-16
Electronic Component
180MHz
Electronic Component
Analog Switch / Multiplexer
Electronic Component
0.11g
Electronic Component
1
Channel Count
8
Features
Analog
Electronic Component
BM0227715636
Operating Temperature
40℃~+125℃
Operating Voltage
2V~6V;-6V~0V
Switch
8:1
(tpd)
12ns

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

74HC4051MT/TR 产品概述

一、产品简介

74HC4051MT/TR(品牌:HGSEMI/华冠)是一款高速八通道模拟多路开关(8:1),采用TSSOP-16封装。器件支持单电源或双电源工作,适用于模拟信号的选择、路由与采集,工作温度范围宽(-40℃~+125℃),适合工业级应用。

二、主要参数

  • 通道数:8(8:1 多路复用/解复用)
  • 工作电压:VCC 2V~6V;VEE 支持 -6V~0V(可实现双极信号传输,单电源时将 VEE 接地)
  • 导通电阻 RON:典型 70Ω(视输入电平有所变化)
  • 带宽:约 180MHz(小信号传输时)
  • 开关速度:导通时间 ton ≈ 45ns;关闭时间 toff ≈ 38ns;传播延迟 tpd ≈ 12ns
  • 工作温度:-40℃~+125℃
  • 封装:TSSOP-16(型号后缀 /TR 表示带卷带包装)

三、功能特点

  • 高速低延迟:tpd、ton/toff 均在纳秒级,适合快速切换场景。
  • 宽带宽、宽动态范围:180MHz 带宽与双极供电能力,适合音频、视频及传感器信号。
  • 简单的地址控制:三个地址引脚(A、B、C)选择通道,带使能(EN)控制。
  • 工业级温度范围与小尺寸封装,便于高密度电路设计。

四、典型应用

  • 多路传感器输入采集与切换(数据采集系统、测量仪器)
  • 音频/视频信号路由与切换(多路音频切换器、摄像头选择)
  • 仪器放大器输入切换、通道复用设计
  • 自动测试设备(ATE)与多通道模拟信号分配

五、设计与使用建议

  • 电源旁路:在 VCC 与 VEE(或 GND)处放置 0.1µF 及适当的去耦电容,减少瞬态干扰。
  • 信号范围:确保模拟信号电压始终在 VEE 至 VCC 之间,避免超出以免出现导通电阻变化或损坏。
  • Ron 的影响:对精密测量或低阻抗负载,建议在输入/输出端加缓冲或采用校正算法补偿 70Ω 量级的导通电阻。
  • 开关时序:控制线在交换过程中可能出现瞬态,必要时在控制引脚上加滤波或限速以减少干扰。
  • 布局注意:模拟与数字地分区、短走线、避免大电流过近,TSSOP-16 封装对散热和焊盘设计要遵循封装手册。

本器件兼具高速与通用性,适合对通道数与带宽有较高需求的模拟多路切换场景。购买与设计时请参考厂家完整数据手册以获得详细电气特性和引脚定义。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.