WMSIC Electronic Components

HGSEMI HGA1050M/TR HGA1050M

ModelHGA1050M/TR
PackageSOIC-8
BrandHGSEMI
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
HGSEMI HGA1050M / TR
Type
HGSEMI
Minimum package
2500 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
HGSEMI
Electronic Component
HGA1050M/TR
Electronic Component
1
Package
SOIC-8
Type
CAN Transceiver
Electronic Component
CAN Transceiver
Electronic Component
0.133g
Electronic Component
1
Channel Count
1
Features
ESD; TXD; Low Power; Bus
Electronic Component
BM0227597198
Operating Temperature
40℃~+125℃
Operating Voltage
4.75V~5.25V
Operating Current
75mA
Data
1Mbps

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

HGA1050M/TR 产品概述

一、产品简介

HGA1050M/TR 是华冠(HGSEMI)推出的一款高速 CAN 收发器,针对车载与工业现场总线通信设计。器件支持最高 1 Mbps 的数据速率,工作电压范围为 4.75 V 至 5.25 V,工作电流典型值 75 mA,工作温度范围为 -40 ℃ 至 +125 ℃,以 SOIC-8 封装提供,适合自动化控制、车载电子与分布式通信节点应用。

二、主要性能特性

  • 类型:高速 CAN 收发器
  • 最大数据速率:1 Mbps,满足典型高速 CAN 总线需求
  • 供电电压:4.75 V ~ 5.25 V
  • 工作电流:约 75 mA(典型)
  • 工作温度:-40 ℃ ~ +125 ℃(工业级)
  • 封装:SOIC-8,便于 PCB 布局和自动贴装
  • 可靠性:工业温度与标准封装适配,适合长期驻地工作

注:基于典型工作电流,器件在 VCC = 5 V 时最大静态功耗约为 0.375 W,应在热设计中予以考虑。

三、典型应用场景

  • 车身电子控制单元(ECU)和车载网关
  • 工业现场总线、PLC 与运动控制系统
  • 楼宇自动化、能源管理与远程数据采集
  • 智能传感器节点与设备间通信接口

四、系统设计与布局建议

  • 终端匹配:在 CAN_H 与 CAN_L 之间使用 120 Ω 终端电阻,贴近器件端口布置以减少反射。
  • 电源管理:在 VCC 引脚靠近位置放置 0.1 µF 旁路电容并接地,以抑制电源噪声和瞬态。
  • 共模抑制:建议在总线侧添加 CAN 专用共模电感或磁珠及 TVS 浪涌保护器,以提高抗干扰与雷击保护能力。
  • 布局要点:保持 CAN_H/CAN_L 差分线长度一致、并尽量短直;器件附近保留连续地平面以利散热与稳定信号参考。
  • 接地策略:模块采用单点接地与良好接地平面,避免地弹回和干扰耦合。

五、散热与可靠性注意

  • 器件在典型工作条件下有一定功耗(约 0.375 W),在密集布局或高环境温度下,应保证足够的 PCB 铜箔面积做散热路径。
  • 工作温度范围覆盖工业级需求,适合汽车与工业长期运行,但应避免连续在最高温度下运行以延长寿命。

六、封装与订购信息

  • 封装形式:SOIC-8,支持自动化贴片安装
  • 型号说明:HGA1050M/TR(/TR 常表示卷带(Tape & Reel)包装,便于大批量 SMT 生产)
  • 建议在采购与设计阶段向供应商索取完整数据手册、封装尺寸图与回流焊工艺建议,以确保可靠的系统集成。

HGA1050M/TR 提供了稳定的高速 CAN 接口能力与工业级温度适应性,适合对通信可靠性与环境适应性有较高要求的应用场合。

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