WMSIC Electronic Components

HGSEMI SP3485EIMM/TR SP3485EIMM

ModelSP3485EIMM/TR
PackageMSOP-8
BrandHGSEMI
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
HGSEMI SP3485EIMM / TR
Type
HGSEMI
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
HGSEMI
Electronic Component
SP3485EIMM/TR
Electronic Component
1
Package
MSOP-8
Type
Transceiver
Electronic Component
RS-485 / RS-422IC
Electronic Component
0.15g
Electronic Component
256
Electronic Component
1
Features
Tx / Rx;;;; Low Power
Electronic Component
BM0227688673
Operating Temperature
40℃~+85℃
Operating Voltage
3V~3.6V
Receiver
1
Data
12Mbps

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

SP3485EIMM/TR 产品概述

一、概述

SP3485EIMM/TR 是华冠(HGSEMI)推出的一款低功耗、差分半双工收发器,适用于多节点差分总线系统。器件采用 MSOP-8 封装,工作电压 3.0V~3.6V,工作温度范围 -40℃~+85℃,在资源受限及工业级环境中表现稳定可靠。器件支持高达 12 Mbps 的数据速率,单驱动器/单接收器配置,理论节点数可达 256,非常适合多点布线和远距离通信场景。

二、主要参数

  • 类型:收发器(半双工)
  • 工作电压:3.0V ~ 3.6V
  • 工作温度:-40℃ ~ +85℃
  • 数据速率:最高 12 Mbps
  • 静态电流:800 μA(典型/最大静态功耗)
  • 驱动器/接收器:1 驱动器 / 1 接收器
  • 支持节点数:最多 256 节点(多点差分总线)
  • 封装:MSOP-8
  • 品牌:HGSEMI(华冠)

三、关键特性

  • 低电压供电:3.0V~3.6V 电源,适配 3.3V 系统,便于与 MCU、FPGA 等器件直接接口。
  • 高速传输:支持最高 12 Mbps,满足高速数据采集与实时控制的通信需求。
  • 低功耗:静态电流约 800 μA,有利于电池供电或能耗敏感的应用。
  • 多点通信:差分半双工结构与最多 256 节点支持,适合多主站/从站网络拓扑。
  • 小体积封装:MSOP-8 有利于 PCB 空间受限的工业或消费类应用。

四、典型应用场景

  • 工业自动化现场总线、PLC 与远程 I/O 通信
  • 楼宇自动化与安防控制系统
  • 数据采集与传感器网络(多点测量)
  • 智能表计与抄表系统
  • 嵌入式设备间的远距离差分通信

五、封装与布局建议

  • 封装:MSOP-8(节省板面空间,适合密集设计)。
  • 电源退耦:靠近 VCC 引脚放置 0.1 μF 陶瓷电容,降低电源噪声并改善瞬态响应。
  • 差分线布线:A/B 差分对尽量成对布线,长度匹配,走向一致以降低串扰。
  • 终端与偏置:长线或总线拓扑建议在总线两端并联 120 Ω 终端电阻,并根据系统需要配置偏置电阻或失效保护,保证空闲线的稳定电平。

六、设计与注意事项

  • 总线节点数多时,应考虑负载与信号完整性,必要时使用中继或分段驱动。
  • 电源与地应良好接地,工业环境建议采取屏蔽和滤波措施以增强抗干扰能力。
  • 器件处于静态或待机状态时仍有 800 μA 的静态电流消耗,电池供电系统需在功耗预算中考虑该值。
  • 如需更强的 ESD/浪涌保护,可在差分引脚外部并联 TVS 或限流元件。

七、优势总结

SP3485EIMM/TR 以小封装、低电压、低静态功耗及高达 12 Mbps 的速率,为多点差分半双工网络提供了兼顾性能与成本的解决方案。其工业级温度范围与 256 节点支持,使之在楼宇、工业控制和远程数据采集等应用中具有良好适配性。针对具体应用,推荐结合终端匹配、退耦电容和适当的布线策略,以获得最佳通信可靠性与信号完整性。

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